GB1423549A - Formation of miniature electrical conductors - Google Patents

Formation of miniature electrical conductors

Info

Publication number
GB1423549A
GB1423549A GB3060273A GB3060273A GB1423549A GB 1423549 A GB1423549 A GB 1423549A GB 3060273 A GB3060273 A GB 3060273A GB 3060273 A GB3060273 A GB 3060273A GB 1423549 A GB1423549 A GB 1423549A
Authority
GB
United Kingdom
Prior art keywords
section
trapezium
lies
ratio
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3060273A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Publication of GB1423549A publication Critical patent/GB1423549A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Conductors (AREA)

Abstract

1423549 Electric conductors; printed circuits BUCKBEE-MEARS CO 27 June 1973 [15 Sept 1972] 30602/73 Headings H1A and H1R A process for making a conductor of rectangular section in printed-circuit production; comprises the steps of etching a conductive layer until regions below a resist pattern 12 are undercut to leave a first portion 13 of symmetrical trapeziform cross-section; then electroplating the first portion 13 with a complementary second portion 14 until the required section is built up. The natural tendency of the electroplating process to deposit ridges at the corners corrects the tendency of the etching process to taper the section. The angle # between each trapeziform side and the normal to the substrate 11 is arranged to fall between 10‹ and 30‹. The ratio of the base of the required final section W 2 to that of the trapezium W 1 lies between 3 and 4, and the ratio of the height of the final section h 2 to that of the trapezium h 1 lies between 2.8 and 8. The process is preferably used to make conductors having widths W 2 not exceeding 0À015 inch.
GB3060273A 1972-09-15 1973-06-27 Formation of miniature electrical conductors Expired GB1423549A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28972872A 1972-09-15 1972-09-15

Publications (1)

Publication Number Publication Date
GB1423549A true GB1423549A (en) 1976-02-04

Family

ID=23112815

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3060273A Expired GB1423549A (en) 1972-09-15 1973-06-27 Formation of miniature electrical conductors

Country Status (9)

Country Link
US (1) US3776820A (en)
JP (1) JPS4964870A (en)
BE (1) BE804867A (en)
CA (1) CA993533A (en)
DE (1) DE2344845A1 (en)
FR (1) FR2200727B1 (en)
GB (1) GB1423549A (en)
IT (1) IT995313B (en)
NL (1) NL7312289A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7704186A (en) * 1977-04-18 1978-10-20 Philips Nv PROCEDURE FOR GALVANIC REINFORCEMENT OF A CONDUCTIVE BASIC PATTERN AND EQUIPMENT OBTAINED USING THE PROCESS.
ES2140310B1 (en) * 1997-07-30 2000-10-16 Mecanismos Aux Es Ind S A IMPROVEMENTS IN THE DESIGNS OF INTERLAYS IN THE PRINTED CIRCUITS OF POWER.
US6348659B1 (en) * 1999-01-07 2002-02-19 Thomas & Betts International, Inc. Resilient electrical interconnects having non-uniform cross-section
FR3144080A1 (en) 2022-12-22 2024-06-28 Smrc Automotive Holdings Netherlands B.V. Vehicle interior trim part and its manufacturing process

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1318654A (en) * 1961-12-19 1963-02-22 Normacem Soc Process for manufacturing electrical circuits and circuits obtained by this process

Also Published As

Publication number Publication date
IT995313B (en) 1975-11-10
CA993533A (en) 1976-07-20
JPS4964870A (en) 1974-06-24
DE2344845A1 (en) 1974-03-21
BE804867A (en) 1974-03-14
FR2200727A1 (en) 1974-04-19
FR2200727B1 (en) 1977-02-18
NL7312289A (en) 1974-03-19
US3776820A (en) 1973-12-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee