IT995313B - PROCESS FOR FORMING MINIATURIZED ELECTRIC CONDUCTORS - Google Patents

PROCESS FOR FORMING MINIATURIZED ELECTRIC CONDUCTORS

Info

Publication number
IT995313B
IT995313B IT28735/73A IT2873573A IT995313B IT 995313 B IT995313 B IT 995313B IT 28735/73 A IT28735/73 A IT 28735/73A IT 2873573 A IT2873573 A IT 2873573A IT 995313 B IT995313 B IT 995313B
Authority
IT
Italy
Prior art keywords
electric conductors
miniaturized electric
forming
forming miniaturized
conductors
Prior art date
Application number
IT28735/73A
Other languages
Italian (it)
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Application granted granted Critical
Publication of IT995313B publication Critical patent/IT995313B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Conductors (AREA)
IT28735/73A 1972-09-15 1973-09-10 PROCESS FOR FORMING MINIATURIZED ELECTRIC CONDUCTORS IT995313B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28972872A 1972-09-15 1972-09-15

Publications (1)

Publication Number Publication Date
IT995313B true IT995313B (en) 1975-11-10

Family

ID=23112815

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28735/73A IT995313B (en) 1972-09-15 1973-09-10 PROCESS FOR FORMING MINIATURIZED ELECTRIC CONDUCTORS

Country Status (9)

Country Link
US (1) US3776820A (en)
JP (1) JPS4964870A (en)
BE (1) BE804867A (en)
CA (1) CA993533A (en)
DE (1) DE2344845A1 (en)
FR (1) FR2200727B1 (en)
GB (1) GB1423549A (en)
IT (1) IT995313B (en)
NL (1) NL7312289A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7704186A (en) * 1977-04-18 1978-10-20 Philips Nv PROCEDURE FOR GALVANIC REINFORCEMENT OF A CONDUCTIVE BASIC PATTERN AND EQUIPMENT OBTAINED USING THE PROCESS.
ES2140310B1 (en) * 1997-07-30 2000-10-16 Mecanismos Aux Es Ind S A IMPROVEMENTS IN THE DESIGNS OF INTERLAYS IN THE PRINTED CIRCUITS OF POWER.
US6348659B1 (en) * 1999-01-07 2002-02-19 Thomas & Betts International, Inc. Resilient electrical interconnects having non-uniform cross-section
FR3144080A1 (en) 2022-12-22 2024-06-28 Smrc Automotive Holdings Netherlands B.V. Vehicle interior trim part and its manufacturing process

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1318654A (en) * 1961-12-19 1963-02-22 Normacem Soc Process for manufacturing electrical circuits and circuits obtained by this process

Also Published As

Publication number Publication date
FR2200727A1 (en) 1974-04-19
CA993533A (en) 1976-07-20
GB1423549A (en) 1976-02-04
BE804867A (en) 1974-03-14
FR2200727B1 (en) 1977-02-18
JPS4964870A (en) 1974-06-24
US3776820A (en) 1973-12-04
DE2344845A1 (en) 1974-03-21
NL7312289A (en) 1974-03-19

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