GB1397430A - Semiconductor components - Google Patents
Semiconductor componentsInfo
- Publication number
- GB1397430A GB1397430A GB4756872A GB4756872A GB1397430A GB 1397430 A GB1397430 A GB 1397430A GB 4756872 A GB4756872 A GB 4756872A GB 4756872 A GB4756872 A GB 4756872A GB 1397430 A GB1397430 A GB 1397430A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrode
- semi
- contact
- pressure
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 2
- 229910052750 molybdenum Inorganic materials 0.000 abstract 2
- 239000011733 molybdenum Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722204490 DE2204490A1 (de) | 1972-01-31 | 1972-01-31 | Halbleiterbauelement mit druckkontakt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1397430A true GB1397430A (en) | 1975-06-11 |
Family
ID=5834583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4756872A Expired GB1397430A (en) | 1972-01-31 | 1972-10-16 | Semiconductor components |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS4885079A (enExample) |
| CH (1) | CH541869A (enExample) |
| DE (1) | DE2204490A1 (enExample) |
| FR (1) | FR2169819B1 (enExample) |
| GB (1) | GB1397430A (enExample) |
| IT (1) | IT972620B (enExample) |
| NL (1) | NL7217019A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2727319A1 (de) * | 1977-06-16 | 1979-01-04 | Nippon Electric Co | Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode |
| JPS55121654A (en) * | 1979-03-13 | 1980-09-18 | Toshiba Corp | Compression bonded semiconductor device |
| JPS5871633A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |
| DE10330053A1 (de) * | 2003-07-03 | 2005-02-10 | Infineon Technologies Ag | Halbleiterbauelement mit einem Druckkontakt und Ronde für einen Druckkontakt eines Halbleiterbauelements |
| DE102004059389B4 (de) * | 2004-12-09 | 2012-02-23 | Infineon Technologies Ag | Halbleiterbauelement mit Ausgleichsmetallisierung |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS413220Y1 (enExample) * | 1965-01-02 | 1966-02-23 |
-
1972
- 1972-01-31 DE DE19722204490 patent/DE2204490A1/de active Pending
- 1972-10-03 CH CH1440772A patent/CH541869A/de not_active IP Right Cessation
- 1972-10-16 GB GB4756872A patent/GB1397430A/en not_active Expired
- 1972-12-14 NL NL7217019A patent/NL7217019A/xx unknown
- 1972-12-18 FR FR7245017A patent/FR2169819B1/fr not_active Expired
- 1972-12-20 IT IT3323472A patent/IT972620B/it active
-
1973
- 1973-01-31 JP JP1282873A patent/JPS4885079A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NL7217019A (enExample) | 1973-08-02 |
| JPS4885079A (enExample) | 1973-11-12 |
| CH541869A (de) | 1973-09-15 |
| FR2169819B1 (enExample) | 1977-12-30 |
| IT972620B (it) | 1974-05-31 |
| DE2204490A1 (de) | 1973-08-09 |
| FR2169819A1 (enExample) | 1973-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |