GB1378876A - Method of making a semiconductor wafer - Google Patents

Method of making a semiconductor wafer

Info

Publication number
GB1378876A
GB1378876A GB4176271A GB4176271A GB1378876A GB 1378876 A GB1378876 A GB 1378876A GB 4176271 A GB4176271 A GB 4176271A GB 4176271 A GB4176271 A GB 4176271A GB 1378876 A GB1378876 A GB 1378876A
Authority
GB
United Kingdom
Prior art keywords
groove
tip
wafer
slots
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4176271A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7858370A external-priority patent/JPS5013112B1/ja
Priority claimed from JP45096065A external-priority patent/JPS506305B1/ja
Priority claimed from JP46004885A external-priority patent/JPS5217278B1/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB1378876A publication Critical patent/GB1378876A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02035—Shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
GB4176271A 1970-09-08 1971-09-07 Method of making a semiconductor wafer Expired GB1378876A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7858370A JPS5013112B1 (enrdf_load_stackoverflow) 1970-09-08 1970-09-08
JP8942270 1970-09-08
JP45096065A JPS506305B1 (enrdf_load_stackoverflow) 1970-10-30 1970-10-30
JP46004885A JPS5217278B1 (enrdf_load_stackoverflow) 1971-02-05 1971-02-05

Publications (1)

Publication Number Publication Date
GB1378876A true GB1378876A (en) 1974-12-27

Family

ID=27454181

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4176271A Expired GB1378876A (en) 1970-09-08 1971-09-07 Method of making a semiconductor wafer

Country Status (4)

Country Link
CA (1) CA970073A (enrdf_load_stackoverflow)
DE (1) DE2144942C3 (enrdf_load_stackoverflow)
GB (1) GB1378876A (enrdf_load_stackoverflow)
NL (1) NL7112376A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178594A (en) * 1985-06-24 1987-02-11 Christopher Frank Mcconnell Vessel and system for treating wafers with fluids
EP2112967A4 (en) * 2007-02-22 2012-03-28 Hana Silicon Inc METHODS OF MAKING SILICON MATERIAL FOR PLASMA PROCESSING APPARATUS

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3010866A1 (de) * 1980-03-21 1981-10-01 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum zersaegen von kristallstaeben
DE3716943A1 (de) * 1987-05-20 1988-12-08 Hans J Scheel Verfahren und vorrichtung zum trennen von insbesondere stabfoermigem material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178594A (en) * 1985-06-24 1987-02-11 Christopher Frank Mcconnell Vessel and system for treating wafers with fluids
GB2178594B (en) * 1985-06-24 1989-12-20 Christopher Frank Mcconnell Vessel and system for treating wafers with fluids
EP2112967A4 (en) * 2007-02-22 2012-03-28 Hana Silicon Inc METHODS OF MAKING SILICON MATERIAL FOR PLASMA PROCESSING APPARATUS

Also Published As

Publication number Publication date
DE2144942A1 (de) 1972-04-06
DE2144942C3 (de) 1979-04-05
CA970073A (en) 1975-06-24
NL7112376A (enrdf_load_stackoverflow) 1972-03-10
DE2144942B2 (de) 1978-08-17

Similar Documents

Publication Publication Date Title
GB1176072A (en) Boring Bar Cartridge.
FR1281450A (fr) Outil de coupe, notamment pour gazon
GB1378876A (en) Method of making a semiconductor wafer
GB1402946A (en) Parting tool
ES315117A1 (es) Dispositivo portautiles para sujetar herramientas cortantes amovibles.
US2343953A (en) Hand compression tool for dies and cutters
GB1392026A (en) Tool holder for holding a cutting bit particularly a parting tool
GB1405934A (en) Device and methof for notching or notching and parting wire in preparation for butt-welding
US3564684A (en) Stepped cutoff blade
GB550941A (en) Improvements in and relating to tools and tool holders for boring and turning
GB1040804A (en) A process and device for cutting up metal bars and metal wires
CN210414642U (zh) 水口加工装置
GB627666A (en) Improvements relating to stone cutters
GB1017309A (en) Improvements in or relating to holders for replaceable cutting tips or blades
GB974347A (en) Tool-holder for a machine tool
GB946112A (en) Improvements in or relating to lathe and other cutting tools
GB742266A (en) Improvements in means for supporting tools or tool holders in slotting and similar reciprocatory machines
GB1100241A (en) Improvements in lathe tools
GB1111032A (en) Apparatus for making grooves in deep bores in a workpiece
GB625229A (en) Improved means for cutting circular holes in sheet metal or other material
GB550906A (en) Improvements in and in the manufacture of diamond and like tools
DE821136C (de) Balken fuer Vielfachgeraet
GB975130A (en) Improvements in machine tool-holder slides and cutting tool-holders
JPS53117373A (en) Production of semiconductor pellets
GB179052A (en) A new or improved process for cutting metals and the like, and apparatus for use therewith

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee