GB1378876A - Method of making a semiconductor wafer - Google Patents

Method of making a semiconductor wafer

Info

Publication number
GB1378876A
GB1378876A GB4176271A GB4176271A GB1378876A GB 1378876 A GB1378876 A GB 1378876A GB 4176271 A GB4176271 A GB 4176271A GB 4176271 A GB4176271 A GB 4176271A GB 1378876 A GB1378876 A GB 1378876A
Authority
GB
United Kingdom
Prior art keywords
groove
tip
wafer
slots
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4176271A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7858370A external-priority patent/JPS5013112B1/ja
Priority claimed from JP9606570A external-priority patent/JPS506305B1/ja
Priority claimed from JP488571A external-priority patent/JPS5217278B1/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB1378876A publication Critical patent/GB1378876A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02035—Shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

1378876 Picking-up tools; working semiconductors SONY CORP 7 Sept 1971 [8 Sept 1970 (2) 30 Oct 1970 5 Feb 1971] 41762/71 Headings B4W and B5E [Also in Divisions B3 and H1] A tool (Fig. 6A) for picking-up apertured semi-conductor wafers is formed from a hollow cylinder with a peripheral groove 52 adjacent one end by cutting two slots 48 from one end parallel to its axis. With the legs defined by the slots pinched together the grooved end of the tool is passed through the aperture in the wafer and the legs released so that the groove engages the walls of the aperture. The tool may have a loop at 54 for hanging on a hook. In a modification with only two slots the ends of the legs are tapered to engage the mating walls of a recess formed in a projection from a holder over which the wafer is to be dropped. The central bore of a rod from which the apertured wafer is sliced is cut ultrasonically. The cutter (Fig. 18) comprises a ferrite or magnetostrictive structure 118 producing longitudinal vibrations which are communicated to a cutting tip 121 shown more clearly in Fig. 19A, by a hollow stainless steel pipe, an odd number of half-wavelengths long, through which water mixed with carborundum is fed to the cutting tip. This tip, the dimensions of which are given, has a groove between two flanges generally of the same profile as the required hole but with angularly offset sets of grooves 131, 132 to allow polishing material entering the cutting area via holes 133 in the groove to escape. The forward end of the tip, which is apertured to leave a core centrally of the hole, is conical.
GB4176271A 1970-09-08 1971-09-07 Method of making a semiconductor wafer Expired GB1378876A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7858370A JPS5013112B1 (en) 1970-09-08 1970-09-08
JP8942270 1970-09-08
JP9606570A JPS506305B1 (en) 1970-10-30 1970-10-30
JP488571A JPS5217278B1 (en) 1971-02-05 1971-02-05

Publications (1)

Publication Number Publication Date
GB1378876A true GB1378876A (en) 1974-12-27

Family

ID=27454181

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4176271A Expired GB1378876A (en) 1970-09-08 1971-09-07 Method of making a semiconductor wafer

Country Status (4)

Country Link
CA (1) CA970073A (en)
DE (1) DE2144942C3 (en)
GB (1) GB1378876A (en)
NL (1) NL7112376A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178594A (en) * 1985-06-24 1987-02-11 Christopher Frank Mcconnell Vessel and system for treating wafers with fluids
EP2112967A1 (en) * 2007-02-22 2009-11-04 Hana Silicon, Inc. Method for manufacturing silicon matter for plasma processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3010866A1 (en) * 1980-03-21 1981-10-01 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Crystal discs cutting system from rod - uses rod rotation about external axis
DE3716943A1 (en) * 1987-05-20 1988-12-08 Hans J Scheel Process and device for separating material, in particular in bar form

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178594A (en) * 1985-06-24 1987-02-11 Christopher Frank Mcconnell Vessel and system for treating wafers with fluids
GB2178594B (en) * 1985-06-24 1989-12-20 Christopher Frank Mcconnell Vessel and system for treating wafers with fluids
EP2112967A1 (en) * 2007-02-22 2009-11-04 Hana Silicon, Inc. Method for manufacturing silicon matter for plasma processing apparatus
EP2112967A4 (en) * 2007-02-22 2012-03-28 Hana Silicon Inc Method for manufacturing silicon matter for plasma processing apparatus

Also Published As

Publication number Publication date
CA970073A (en) 1975-06-24
DE2144942A1 (en) 1972-04-06
DE2144942C3 (en) 1979-04-05
DE2144942B2 (en) 1978-08-17
NL7112376A (en) 1972-03-10

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee