GB1374008A - Method of soldering - Google Patents
Method of solderingInfo
- Publication number
- GB1374008A GB1374008A GB2535672A GB2535672A GB1374008A GB 1374008 A GB1374008 A GB 1374008A GB 2535672 A GB2535672 A GB 2535672A GB 2535672 A GB2535672 A GB 2535672A GB 1374008 A GB1374008 A GB 1374008A
- Authority
- GB
- United Kingdom
- Prior art keywords
- mixture
- bisphenol
- ether
- resin
- carboxy terminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 12
- 239000000203 mixture Substances 0.000 abstract 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 5
- 229920000642 polymer Polymers 0.000 abstract 5
- 239000005062 Polybutadiene Substances 0.000 abstract 4
- 229920002857 polybutadiene Polymers 0.000 abstract 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract 3
- IWYRWIUNAVNFPE-UHFFFAOYSA-N Glycidaldehyde Chemical compound O=CC1CO1 IWYRWIUNAVNFPE-UHFFFAOYSA-N 0.000 abstract 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 3
- 230000005494 condensation Effects 0.000 abstract 3
- 238000009833 condensation Methods 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 230000004907 flux Effects 0.000 abstract 3
- -1 heterocyclic diamine Chemical class 0.000 abstract 3
- KPRZOPQOBJRYSW-UHFFFAOYSA-N o-hydroxybenzylamine Natural products NCC1=CC=CC=C1O KPRZOPQOBJRYSW-UHFFFAOYSA-N 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- FLROJJGKUKLCAE-UHFFFAOYSA-N 3-amino-2-methylphenol Chemical class CC1=C(N)C=CC=C1O FLROJJGKUKLCAE-UHFFFAOYSA-N 0.000 abstract 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- KNRCVAANTQNTPT-UHFFFAOYSA-N methyl-5-norbornene-2,3-dicarboxylic anhydride Chemical compound O=C1OC(=O)C2C1C1(C)C=CC2C1 KNRCVAANTQNTPT-UHFFFAOYSA-N 0.000 abstract 2
- 150000001451 organic peroxides Chemical class 0.000 abstract 2
- RMDKEBZUCHXUER-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1(C)C2 RMDKEBZUCHXUER-UHFFFAOYSA-N 0.000 abstract 1
- UPMZXBCYMCZOIG-UHFFFAOYSA-N 6-[(4-methyl-7-oxabicyclo[4.1.0]heptan-3-yl)methoxy]-6-oxohexanoic acid Chemical compound C1C(COC(=O)CCCCC(O)=O)C(C)CC2OC21 UPMZXBCYMCZOIG-UHFFFAOYSA-N 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15858071A | 1971-06-30 | 1971-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1374008A true GB1374008A (en) | 1974-11-13 |
Family
ID=22568791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2535672A Expired GB1374008A (en) | 1971-06-30 | 1972-05-31 | Method of soldering |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3791027A (enExample) |
| DE (1) | DE2231299A1 (enExample) |
| FR (1) | FR2143734B1 (enExample) |
| GB (1) | GB1374008A (enExample) |
| IT (1) | IT959648B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2292375A1 (fr) * | 1974-11-21 | 1976-06-18 | Inst Nat Sante Rech Med | Generateur d'impulsions de frequences audibles |
| US4216035A (en) * | 1977-12-23 | 1980-08-05 | International Business Machines Corporation | Removable protective coating and process of using same |
| US4369287A (en) * | 1981-03-16 | 1983-01-18 | Motorola Inc. | Permanent fluxing agent and solder-through conformal coating |
| US4504007A (en) * | 1982-09-14 | 1985-03-12 | International Business Machines Corporation | Solder and braze fluxes and processes for using the same |
| US4547304A (en) * | 1984-08-30 | 1985-10-15 | Texaco, Inc. | Nonfuming solder cleansing and fusing fluids |
| US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
| US5145722A (en) * | 1989-04-11 | 1992-09-08 | Hughes Aircraft Company | Method and composition for protecting and enhancing the solderability of metallic surfaces |
| JP2503099B2 (ja) * | 1989-08-08 | 1996-06-05 | 日本電装株式会社 | はんだ付け用フラックス |
| US5127968A (en) * | 1989-08-16 | 1992-07-07 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| WO1992005228A1 (en) * | 1990-09-17 | 1992-04-02 | Motorola, Inc. | Solder pastes containing acrylic acid and derivatives thereof |
| JPH058085A (ja) * | 1990-11-30 | 1993-01-19 | Nippondenso Co Ltd | はんだ付け用フラツクス |
| GB2287253B (en) * | 1992-03-19 | 1996-04-03 | Fujitsu Ltd | Removal of oxide film from a metal |
| GB2265156B (en) * | 1992-03-19 | 1996-04-03 | Fujitsu Ltd | Methods for making metal particles spherical and removing oxide film therefrom |
| CA2221961C (en) * | 1995-05-24 | 2008-02-05 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
| US7041771B1 (en) | 1995-08-11 | 2006-05-09 | Kac Holdings, Inc. | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| JP3378139B2 (ja) * | 1996-03-19 | 2003-02-17 | 株式会社デンソー | はんだ付け用のフラックス |
| US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
| US6449834B1 (en) * | 1997-05-02 | 2002-09-17 | Scilogy Corp. | Electrical conductor coils and methods of making same |
| US6367150B1 (en) | 1997-09-05 | 2002-04-09 | Northrop Grumman Corporation | Solder flux compatible with flip-chip underfill material |
| US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
| MY139328A (en) * | 2002-05-20 | 2009-09-30 | Nitto Denko Corp | Thermosetting resin composition and semiconductor device obtained with the same |
| JP3952189B2 (ja) * | 2003-02-06 | 2007-08-01 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| DE102005053553A1 (de) * | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Lotpasten mit harzfreien Flussmittel |
| JP6260814B2 (ja) * | 2011-06-02 | 2018-01-17 | パナソニックＩｐマネジメント株式会社 | 電子部品実装方法、電子部品搭載装置および電子部品実装システム |
| WO2015193684A1 (en) * | 2014-06-19 | 2015-12-23 | Alpha Metals, Inc. | Engineered residue solder paste technology |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2833030A (en) * | 1952-09-19 | 1958-05-06 | Wall Colmonoy Corp | Method of joining metal parts with flexible composite joining material |
| US2816357A (en) * | 1953-08-27 | 1957-12-17 | Bjorksten Res Lab Inc | Method of soldering with a polyester flux |
| US3035339A (en) * | 1957-08-12 | 1962-05-22 | Gen Motors Corp | Method of soldering and flux therefor |
| US3119179A (en) * | 1958-03-10 | 1964-01-28 | Mccord Corp | Soldering flux and method |
| US3040781A (en) * | 1958-04-15 | 1962-06-26 | Martin Marietta Corp | Solderable coating |
| US3376150A (en) * | 1964-09-11 | 1968-04-02 | Du Pont | Imide and polyimide solutions |
| US3264146A (en) * | 1965-09-10 | 1966-08-02 | Continental Can Co | Organic flux compositions and method of using same |
| US3507828A (en) * | 1966-03-09 | 1970-04-21 | Mobil Chem Co | Thermosetting resin made by reaction of epoxy copolymer with polyfunctional amine and then with aldehyde |
| US3436278A (en) * | 1966-08-08 | 1969-04-01 | Ibm | Glycol soldering fluxes |
| US3513125A (en) * | 1967-02-24 | 1970-05-19 | Grace W R & Co | Carbazate crosslinking agent and thermosetting resin compositions and process of making same |
| US3488831A (en) * | 1967-04-14 | 1970-01-13 | Continental Can Co | Fluxing materials for soldering metal surfaces |
| US3655461A (en) * | 1970-09-02 | 1972-04-11 | Sanyo Electric Works | Flux for aluminum soldering |
-
1971
- 1971-06-30 US US00158580A patent/US3791027A/en not_active Expired - Lifetime
-
1972
- 1972-04-26 IT IT23518/72A patent/IT959648B/it active
- 1972-05-31 GB GB2535672A patent/GB1374008A/en not_active Expired
- 1972-06-20 FR FR727222679A patent/FR2143734B1/fr not_active Expired
- 1972-06-26 DE DE2231299A patent/DE2231299A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT959648B (it) | 1973-11-10 |
| FR2143734B1 (enExample) | 1974-07-26 |
| US3791027A (en) | 1974-02-12 |
| DE2231299A1 (de) | 1973-01-11 |
| FR2143734A1 (enExample) | 1973-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |