GB1361167A - Holder for a semiconductor device - Google Patents

Holder for a semiconductor device

Info

Publication number
GB1361167A
GB1361167A GB1005773A GB1005773A GB1361167A GB 1361167 A GB1361167 A GB 1361167A GB 1005773 A GB1005773 A GB 1005773A GB 1005773 A GB1005773 A GB 1005773A GB 1361167 A GB1361167 A GB 1361167A
Authority
GB
United Kingdom
Prior art keywords
spring
leaf spring
scale
march
relative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1005773A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Original Assignee
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722210180 external-priority patent/DE2210180C3/de
Application filed by BBC BROWN BOVERI and CIE, BBC Brown Boveri AG Switzerland filed Critical BBC BROWN BOVERI and CIE
Publication of GB1361167A publication Critical patent/GB1361167A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Die Bonding (AREA)
GB1005773A 1972-03-03 1973-03-01 Holder for a semiconductor device Expired GB1361167A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722210180 DE2210180C3 (de) 1972-03-03 Halter fur ein druckkontaktiertes Halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1361167A true GB1361167A (en) 1974-07-24

Family

ID=5837750

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1005773A Expired GB1361167A (en) 1972-03-03 1973-03-01 Holder for a semiconductor device

Country Status (4)

Country Link
US (1) US3825804A (enExample)
CH (1) CH549868A (enExample)
FR (1) FR2174873B3 (enExample)
GB (1) GB1361167A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0806533B1 (pt) * 2007-01-26 2018-10-09 Inductotherm Corp. dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor
DE102010005792B3 (de) * 2010-01-25 2011-06-16 Innovations-Transfer Uphoff Gmbh &.Co.Kg Druckkraftmesseinrichtung
JP5338980B2 (ja) * 2011-09-13 2013-11-13 トヨタ自動車株式会社 半導体モジュール
US8661890B1 (en) 2012-01-30 2014-03-04 Mark Raithel Rain monitoring system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE441966C (de) * 1924-11-06 1927-03-18 Chretien Mertz Plansichter mit frei laufenden Siebreinigungsbuersten
GB1260657A (en) * 1968-11-26 1972-01-19 Westinghouse Brake & Signal Improvements relating to mountings for rectifier devices
US3571663A (en) * 1969-01-08 1971-03-23 Chemetron Corp Releasable clamp assembly for a solid state circuit element
US3614513A (en) * 1969-07-16 1971-10-19 Sylvania Electric Prod Electron discharge device having novel indirectly heated cathode mounting
US3661013A (en) * 1969-12-23 1972-05-09 Electric Regulator Corp Semiconductor assembly
US3611068A (en) * 1970-05-20 1971-10-05 Matsushita Electric Industrial Co Ltd Contactless pressure sensitive semiconductor switch
US3686541A (en) * 1971-07-19 1972-08-22 Gen Electric A flexible resilient member for applying a clamping force to thyristor units

Also Published As

Publication number Publication date
DE2210180A1 (de) 1973-09-06
US3825804A (en) 1974-07-23
DE2210180B2 (de) 1976-12-30
FR2174873A1 (enExample) 1973-10-19
FR2174873B3 (enExample) 1976-03-05
CH549868A (de) 1974-05-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees