GB1349920A - Cooling devices for electronic components - Google Patents

Cooling devices for electronic components

Info

Publication number
GB1349920A
GB1349920A GB4144972A GB4144972A GB1349920A GB 1349920 A GB1349920 A GB 1349920A GB 4144972 A GB4144972 A GB 4144972A GB 4144972 A GB4144972 A GB 4144972A GB 1349920 A GB1349920 A GB 1349920A
Authority
GB
United Kingdom
Prior art keywords
plate
channel
recess
thyristors
sept
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4144972A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1349920A publication Critical patent/GB1349920A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1349920 Cooling slabs; hollow-plate heat exchange elements SIEMENS AG 7 Sept 1972 [9 Sept 1971] 41449/72 Headings F4H and F4S [Also in Division H1] Electronic components such as thyristors 17 are cooled by a flow of liquid through a channel between two plates 1, 8. The plate 8, which carries coolant pipe connections 11 and is attached, e.g. via metal block 16, to the thyristors 17, is made of high thermal conductivity metal and the plate 1, which may be made of sheet metal or heat-resistant plastics material, has a central flat-bottomed recess occupying most of its area, which recess defines the coolant channel. The recess may be shaped to define a U-shaped or meandering channel. Various methods of attaching the plates 1, 8 to each other and to the block 16 are disclosed. Other semi-conductor components which may be cooled in the manner described are heavy duty transistors and rectifier diodes, and transformers and impedance coils are also mentioned.
GB4144972A 1971-09-09 1972-09-07 Cooling devices for electronic components Expired GB1349920A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712145192 DE2145192A1 (en) 1971-09-09 1971-09-09 COOLING DEVICE

Publications (1)

Publication Number Publication Date
GB1349920A true GB1349920A (en) 1974-04-10

Family

ID=5819142

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4144972A Expired GB1349920A (en) 1971-09-09 1972-09-07 Cooling devices for electronic components

Country Status (7)

Country Link
BE (1) BE788570A (en)
DE (1) DE2145192A1 (en)
FR (1) FR2152652B3 (en)
GB (1) GB1349920A (en)
IT (1) IT967178B (en)
LU (1) LU66023A1 (en)
NL (1) NL7212185A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129613A (en) * 1982-10-18 1984-05-16 Raytheon Co Semiconductor structures and manufacturing methods
EP1729557A3 (en) * 2005-05-31 2008-07-02 Behr Industry GmbH & Co. KG Cooling device for electronic components

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (en) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor rectifier arrangement with high current carrying capacity
WO1995035019A1 (en) * 1994-06-10 1995-12-21 Westinghouse Electric Corporation Low cost fluid-cooled housing for electric vehicle system control unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129613A (en) * 1982-10-18 1984-05-16 Raytheon Co Semiconductor structures and manufacturing methods
EP1729557A3 (en) * 2005-05-31 2008-07-02 Behr Industry GmbH & Co. KG Cooling device for electronic components

Also Published As

Publication number Publication date
DE2145192A1 (en) 1973-03-22
IT967178B (en) 1974-02-28
FR2152652A1 (en) 1973-04-27
FR2152652B3 (en) 1975-10-03
NL7212185A (en) 1973-03-13
BE788570A (en) 1973-03-08
LU66023A1 (en) 1973-03-12

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees