GB1348556A - Laminar structures of crystalline copolyketones - Google Patents
Laminar structures of crystalline copolyketonesInfo
- Publication number
- GB1348556A GB1348556A GB1967471A GB1967471A GB1348556A GB 1348556 A GB1348556 A GB 1348556A GB 1967471 A GB1967471 A GB 1967471A GB 1967471 A GB1967471 A GB 1967471A GB 1348556 A GB1348556 A GB 1348556A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- polyketone
- copolyketone
- pressure
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 7
- 229920001470 polyketone Polymers 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 abstract 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 abstract 2
- 239000011889 copper foil Substances 0.000 abstract 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 abstract 2
- 229910015900 BF3 Inorganic materials 0.000 abstract 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 abstract 1
- -1 isophthaloyl Chemical group 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/704—Crystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4523570A | 1970-06-10 | 1970-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1348556A true GB1348556A (en) | 1974-03-20 |
Family
ID=21936751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1967471A Expired GB1348556A (en) | 1970-06-10 | 1971-06-09 | Laminar structures of crystalline copolyketones |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3668057A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS4949191B1 (cg-RX-API-DMAC10.html) |
| BE (1) | BE768341A (cg-RX-API-DMAC10.html) |
| CA (1) | CA952803A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2128733A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2094162B1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1348556A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527216A2 (fr) * | 1982-05-21 | 1983-11-25 | Kollmorgen Tech Corp | Procede de dissipation, par un traitement par rayonnement, des tensions d'un article en polymere |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3925307A (en) * | 1973-04-23 | 1975-12-09 | Raychem Corp | Antioxidants for polyarylether ketones |
| US4239884A (en) * | 1975-08-11 | 1980-12-16 | Raychem Corporation | Process for isolation of solid polymers |
| DE3205591A1 (de) * | 1982-02-17 | 1983-09-29 | Siemens AG, 1000 Berlin und 8000 München | Basismaterial fuer flexible gedruckte schaltungen |
| DE3343745A1 (de) * | 1983-12-02 | 1985-06-13 | Siemens AG, 1000 Berlin und 8000 München | Mehrlagenschaltungen aus thermoplast-kupfer-verbund |
| US4816556A (en) * | 1985-02-22 | 1989-03-28 | E. I. Du Pont De Nemours And Company | Ordered polyetherketones |
| US4720537A (en) * | 1985-11-25 | 1988-01-19 | E. I. Du Pont De Nemours And Company | Branched copolyetherketones |
| US4704448A (en) * | 1985-11-25 | 1987-11-03 | E. I. Du Pont De Nemours And Company | Copolyetherketones |
| US4996287A (en) * | 1988-12-13 | 1991-02-26 | E. I. Du Pont De Nemours And Company | Thermoformable polyaryletherketone sheet |
| US7790268B2 (en) * | 2007-04-11 | 2010-09-07 | World Properties, Inc. | Circuit materials, multilayer circuits, and methods of manufacture thereof |
| US11976564B1 (en) | 2023-03-30 | 2024-05-07 | Rolls-Royce North American Technologies Inc. | Splined balance weight for rotating components in gas turbine engines |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3013913A (en) * | 1957-08-30 | 1961-12-19 | Westinghouse Electric Corp | Molded printed circuit |
| US3075868A (en) * | 1957-09-09 | 1963-01-29 | Continental Can Co | Method of bonding polymer plastics to substrate webs of dissimilar materials |
| US3065205A (en) * | 1959-10-27 | 1962-11-20 | Du Pont | Aromatic polyketones and preparation thereof |
| US3113896A (en) * | 1961-01-31 | 1963-12-10 | Space Technology Lab Inc | Electron beam masking for etching electrical circuits |
| US3177103A (en) * | 1961-09-18 | 1965-04-06 | Sauders Associates Inc | Two pass etching for fabricating printed circuitry |
| NL293023A (cg-RX-API-DMAC10.html) * | 1962-05-21 | |||
| NL6611019A (cg-RX-API-DMAC10.html) * | 1965-08-04 | 1967-02-06 |
-
1970
- 1970-06-10 US US3668057D patent/US3668057A/en not_active Expired - Lifetime
-
1971
- 1971-06-01 CA CA114,563A patent/CA952803A/en not_active Expired
- 1971-06-09 GB GB1967471A patent/GB1348556A/en not_active Expired
- 1971-06-09 FR FR7120890A patent/FR2094162B1/fr not_active Expired
- 1971-06-09 JP JP4021371A patent/JPS4949191B1/ja active Pending
- 1971-06-09 DE DE19712128733 patent/DE2128733A1/de active Pending
- 1971-06-10 BE BE768341A patent/BE768341A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527216A2 (fr) * | 1982-05-21 | 1983-11-25 | Kollmorgen Tech Corp | Procede de dissipation, par un traitement par rayonnement, des tensions d'un article en polymere |
Also Published As
| Publication number | Publication date |
|---|---|
| BE768341A (fr) | 1971-12-10 |
| US3668057A (en) | 1972-06-06 |
| DE2128733A1 (de) | 1971-12-16 |
| FR2094162B1 (cg-RX-API-DMAC10.html) | 1975-01-17 |
| CA952803A (en) | 1974-08-13 |
| FR2094162A1 (cg-RX-API-DMAC10.html) | 1972-02-04 |
| JPS4949191B1 (cg-RX-API-DMAC10.html) | 1974-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |