GB1336417A - Machine for attaching the connecting wires to the connection points of a semiconductor component and of the housing accommodating the semiconductor component - Google Patents

Machine for attaching the connecting wires to the connection points of a semiconductor component and of the housing accommodating the semiconductor component

Info

Publication number
GB1336417A
GB1336417A GB1073672A GB1073672A GB1336417A GB 1336417 A GB1336417 A GB 1336417A GB 1073672 A GB1073672 A GB 1073672A GB 1073672 A GB1073672 A GB 1073672A GB 1336417 A GB1336417 A GB 1336417A
Authority
GB
United Kingdom
Prior art keywords
disc
component
guide
machine
connection points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1073672A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1336417A publication Critical patent/GB1336417A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0106—Neodymium [Nd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

1336417 Machine for attaching wires to semi-conductor connection points TEXAS INSTRUMENTS Inc 8 March 1972 [25 March 1971] 10736/72 Heading B3A A machine for attaching connecting wires to connection points of a semi-conductor component and to connection points of a housing accommodating the semi-conductor component comprises a wire guide member 5 which is vertically adjustable with respect to the semiconductor component and the housing, an adjustable support member 10 being adjustable in a plane parallel to the plane of the semiconductor component and housing and having a driver member 26 including a guide member 30, Fig. 2, fixed thereto, and a programme carrier having a plurality of guide members 25 complementary to and engageable with the guide member 30 and being advanceable step-by-step into successive detent positions. The machine comprises a frame 1, a table 2, Fig. 1, and a mounting 3 on which the housing and component may be fixed. The wire guide member 5 is mounted on a support 8 pivoted about an axis 9 mounted on a compound table 10. The programme carrier comprises a perforated disc 16 with detent pins 17 adapted to engage a notch (18) Fig. 3 (not shown) in a stop member 19 mounted on an adjustable leaf spring (20). The disc 16 is rotated by an indexing mechanism 21 which comprises a push member 22 and a resilient metal strip 23 driven by mechanism 24 either pneumatically, hydraulically, or electromagnetically. The disc 16 is provided with a plurality of conical bores 25 which act as guide members for associated detent pins 17. A rocker 26 mounted on table 10 and pivotable about an axis 27 is actuable by drive cylinder (28) and comprises a guide cone 30 positioned above the exact location which is assumed by the conical bore 25 in a working position. The distances of the bores 25 from the centre of the disc 16 are dimensioned for a given component to be fabricated such that they correspond to the location of the connection points for the connecting wires, Fig. 4 (not shown). Operation:-Using drive cylinder (28), guide cone 30 is introduced into the first conical bore 25 of a disc 16 when the component and housing are mounted in the prescribed location. The table 10 and capillary 6 are thereby displaced corresponding to the location of the bore. When the cone is centrally aligned to the wire guide moves downwardly enabling welding to take place, e.g. thermo-compressive or ultrasonically, and the wire, gold or aluminium, can also be severed by tearing or burning off. Rocker 26 is then pivoted upwardly and the disc is indexed one step until the next detent pin 17 engages in notch 18 and the guide cone then centres in the next conical bore 25 and bonding can again be carried out. In an alternative embodiment the leaf spring (20) may be acted on by a push member 32 and thus become bent a certain amount to displace stop member 19 so as to turn disc 16 a slight amount to enable welding at closely adjacent points. In order to operate the machine automatically a compound table 34 is disposed below table 10 and connected to a manipulator 36 so that actuation of the latter brings the table into any desired position. A brake 37 is provided to lock the table 34 and a light-spot projector 43 to be directed on to the component. A conical bore 45 co-operates with a guide cone 46 of the rocker 26 to dispose the capillary 6 over the projected light spot which may be observed using a stereomicroscope 4. The table 34 is then locked and bonding can occur. The rocker 26 is then pivoted upwardly and cone 46 enters bore 45 and when centrally aligned the capillary 6 is again above the light spot and the disc is indexed one step. Alternatively, a second perforated disc (49) with bores (51) may be utilized instead of the projector and individual operations of the machine can be controlled by a programme switching mechanism. This controls the time cycle of the discs, actuation of the rocker, reciprocal movement of the capillary, welding and severing operations &c. Linearly displaceable programme carriers may be used instead of perforated disc, and alternative types of co-operating guide members may be used.
GB1073672A 1971-03-25 1972-03-08 Machine for attaching the connecting wires to the connection points of a semiconductor component and of the housing accommodating the semiconductor component Expired GB1336417A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2114496A DE2114496C3 (en) 1971-03-25 1971-03-25 Machine for fastening connecting wires to a plurality of connection points of a semiconductor component and to the associated connection points of a housing accommodating the semiconductor component

Publications (1)

Publication Number Publication Date
GB1336417A true GB1336417A (en) 1973-11-07

Family

ID=5802734

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1073672A Expired GB1336417A (en) 1971-03-25 1972-03-08 Machine for attaching the connecting wires to the connection points of a semiconductor component and of the housing accommodating the semiconductor component

Country Status (5)

Country Link
CA (1) CA957083A (en)
DE (1) DE2114496C3 (en)
FR (1) FR2130712B1 (en)
GB (1) GB1336417A (en)
IT (1) IT952321B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447587A1 (en) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München MACHINE FOR FASTENING THE CONNECTING WIRE AT THE CONNECTION SITES OF A SEMICONDUCTOR COMPONENT AND THE SEMICONDUCTOR COMPONENT HOUSING

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3183421A (en) * 1960-05-16 1965-05-11 Westinghouse Electric Corp Digital positional servo apparatus
NL269297A (en) * 1960-10-06 1900-01-01
NL301740A (en) * 1963-01-02 1900-01-01
US3341632A (en) * 1964-06-24 1967-09-12 Union Carbide Corp Production of organic trithiophosphites
US3305157A (en) * 1965-12-20 1967-02-21 Matheus D Pennings Ultrasonic wire bonder
US3541338A (en) * 1967-01-12 1970-11-17 Ibm Positioning system
US3444612A (en) * 1967-04-10 1969-05-20 Engineered Machine Builders Co Wire bonding method

Also Published As

Publication number Publication date
DE2114496B2 (en) 1974-07-04
CA957083A (en) 1974-10-29
FR2130712A1 (en) 1972-11-03
DE2114496A1 (en) 1972-10-12
DE2114496C3 (en) 1981-05-07
FR2130712B1 (en) 1975-10-24
IT952321B (en) 1973-07-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee