FR2130712A1 - - Google Patents
Info
- Publication number
- FR2130712A1 FR2130712A1 FR7210547A FR7210547A FR2130712A1 FR 2130712 A1 FR2130712 A1 FR 2130712A1 FR 7210547 A FR7210547 A FR 7210547A FR 7210547 A FR7210547 A FR 7210547A FR 2130712 A1 FR2130712 A1 FR 2130712A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/0106—Neodymium [Nd]
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- H01L2924/01067—Holmium [Ho]
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/01076—Osmium [Os]
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- H01L2924/01079—Gold [Au]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2114496A DE2114496C3 (en) | 1971-03-25 | 1971-03-25 | Machine for fastening connecting wires to a plurality of connection points of a semiconductor component and to the associated connection points of a housing accommodating the semiconductor component |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2130712A1 true FR2130712A1 (en) | 1972-11-03 |
FR2130712B1 FR2130712B1 (en) | 1975-10-24 |
Family
ID=5802734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7210547A Expired FR2130712B1 (en) | 1971-03-25 | 1972-03-24 |
Country Status (5)
Country | Link |
---|---|
CA (1) | CA957083A (en) |
DE (1) | DE2114496C3 (en) |
FR (1) | FR2130712B1 (en) |
GB (1) | GB1336417A (en) |
IT (1) | IT952321B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3447587A1 (en) * | 1984-12-28 | 1986-07-10 | Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München | MACHINE FOR FASTENING THE CONNECTING WIRE AT THE CONNECTION SITES OF A SEMICONDUCTOR COMPONENT AND THE SEMICONDUCTOR COMPONENT HOUSING |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3087239A (en) * | 1959-06-19 | 1963-04-30 | Western Electric Co | Methods of bonding leads to semiconductive devices |
US3183421A (en) * | 1960-05-16 | 1965-05-11 | Westinghouse Electric Corp | Digital positional servo apparatus |
NL269297A (en) * | 1960-10-06 | 1900-01-01 | ||
NL301740A (en) * | 1963-01-02 | 1900-01-01 | ||
US3341632A (en) * | 1964-06-24 | 1967-09-12 | Union Carbide Corp | Production of organic trithiophosphites |
US3305157A (en) * | 1965-12-20 | 1967-02-21 | Matheus D Pennings | Ultrasonic wire bonder |
US3541338A (en) * | 1967-01-12 | 1970-11-17 | Ibm | Positioning system |
US3444612A (en) * | 1967-04-10 | 1969-05-20 | Engineered Machine Builders Co | Wire bonding method |
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1971
- 1971-03-25 DE DE2114496A patent/DE2114496C3/en not_active Expired
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1972
- 1972-03-08 GB GB1073672A patent/GB1336417A/en not_active Expired
- 1972-03-20 IT IT49124/72A patent/IT952321B/en active
- 1972-03-24 CA CA138,065A patent/CA957083A/en not_active Expired
- 1972-03-24 FR FR7210547A patent/FR2130712B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2114496B2 (en) | 1974-07-04 |
IT952321B (en) | 1973-07-20 |
DE2114496A1 (en) | 1972-10-12 |
DE2114496C3 (en) | 1981-05-07 |
FR2130712B1 (en) | 1975-10-24 |
GB1336417A (en) | 1973-11-07 |
CA957083A (en) | 1974-10-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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ST | Notification of lapse |