GB1323136A - Philips electronic associated industries ltd methods of applying metal contacts to semiconductor bodies - Google Patents

Philips electronic associated industries ltd methods of applying metal contacts to semiconductor bodies

Info

Publication number
GB1323136A
GB1323136A GB4534070A GB4534070A GB1323136A GB 1323136 A GB1323136 A GB 1323136A GB 4534070 A GB4534070 A GB 4534070A GB 4534070 A GB4534070 A GB 4534070A GB 1323136 A GB1323136 A GB 1323136A
Authority
GB
United Kingdom
Prior art keywords
layer
oxide
contacts
wafer
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4534070A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1323136A publication Critical patent/GB1323136A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
GB4534070A 1969-09-26 1970-09-23 Philips electronic associated industries ltd methods of applying metal contacts to semiconductor bodies Expired GB1323136A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6914593A NL6914593A (ja) 1969-09-26 1969-09-26

Publications (1)

Publication Number Publication Date
GB1323136A true GB1323136A (en) 1973-07-11

Family

ID=19807994

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4534070A Expired GB1323136A (en) 1969-09-26 1970-09-23 Philips electronic associated industries ltd methods of applying metal contacts to semiconductor bodies

Country Status (8)

Country Link
US (1) US3698941A (ja)
JP (1) JPS4827495B1 (ja)
CA (1) CA953036A (ja)
CH (1) CH522953A (ja)
DE (1) DE2043303A1 (ja)
FR (1) FR2063026B1 (ja)
GB (1) GB1323136A (ja)
NL (1) NL6914593A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1419143A (en) * 1972-04-04 1975-12-24 Omron Tateisi Electronics Co Semiconductor photoelectric device
US3900344A (en) * 1973-03-23 1975-08-19 Ibm Novel integratable schottky barrier structure and method for the fabrication thereof
JPS49130597A (ja) * 1973-04-24 1974-12-13
US4033810A (en) * 1974-07-19 1977-07-05 Raytheon Company Method for making avalanche semiconductor amplifier
US4307131A (en) * 1976-01-30 1981-12-22 Thomson-Csf Method of manufacturing metal-semiconductor contacts exhibiting high injected current density
FR2360996A1 (fr) * 1976-06-15 1978-03-03 Thomson Csf Diode semiconductrice utilisant le temps de transit des porteurs de charge, possedant une electrode a matrice de micropointes
US4442137A (en) * 1982-03-18 1984-04-10 International Business Machines Corporation Maskless coating of metallurgical features of a dielectric substrate
US4493856A (en) * 1982-03-18 1985-01-15 International Business Machines Corporation Selective coating of metallurgical features of a dielectric substrate with diverse metals
US4504322A (en) * 1982-10-20 1985-03-12 International Business Machines Corporation Re-work method for removing extraneous metal from cermic substrates
FR2548962B1 (fr) * 1983-07-13 1987-06-05 Saint Gobain Desjonqueres Decor d'objets tels des flacons en verre
US4765865A (en) * 1987-05-04 1988-08-23 Ford Motor Company Silicon etch rate enhancement
US6127268A (en) * 1997-06-11 2000-10-03 Micronas Intermetall Gmbh Process for fabricating a semiconductor device with a patterned metal layer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1531852A (fr) * 1966-07-15 1968-07-05 Itt Procédé de masquage de la surface d'un support
US3558352A (en) * 1966-10-27 1971-01-26 Ibm Metallization process
DE1764269A1 (de) * 1968-05-07 1971-06-16 Siemens Ag Verfahren zum Herstellen von Planarbauelementen,insbesondere von fuer hohe Frequenzen zu verwendende Germanium-Planartransistoren

Also Published As

Publication number Publication date
DE2043303A1 (de) 1971-04-01
NL6914593A (ja) 1971-03-30
FR2063026B1 (ja) 1974-07-12
FR2063026A1 (ja) 1971-07-02
CH522953A (de) 1972-05-15
US3698941A (en) 1972-10-17
JPS4827495B1 (ja) 1973-08-23
CA953036A (en) 1974-08-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee