GB1314648A - Method for manufacturing a semiconductor photosensitive device - Google Patents

Method for manufacturing a semiconductor photosensitive device

Info

Publication number
GB1314648A
GB1314648A GB4746471A GB4746471A GB1314648A GB 1314648 A GB1314648 A GB 1314648A GB 4746471 A GB4746471 A GB 4746471A GB 4746471 A GB4746471 A GB 4746471A GB 1314648 A GB1314648 A GB 1314648A
Authority
GB
United Kingdom
Prior art keywords
substrate
epitaxial layer
resistivity
layer
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4746471A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of GB1314648A publication Critical patent/GB1314648A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/007—Autodoping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/135—Removal of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Weting (AREA)
  • Light Receiving Elements (AREA)
GB4746471A 1970-10-15 1971-10-12 Method for manufacturing a semiconductor photosensitive device Expired GB1314648A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45090009A JPS4936792B1 (enExample) 1970-10-15 1970-10-15

Publications (1)

Publication Number Publication Date
GB1314648A true GB1314648A (en) 1973-04-26

Family

ID=13986638

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4746471A Expired GB1314648A (en) 1970-10-15 1971-10-12 Method for manufacturing a semiconductor photosensitive device

Country Status (3)

Country Link
US (1) US3767494A (enExample)
JP (1) JPS4936792B1 (enExample)
GB (1) GB1314648A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1926132A1 (en) * 2006-11-23 2008-05-28 S.O.I.Tec Silicon on Insulator Technologies Chromium-free etching solution for Si-substrates and SiGe-substrates, method for revealing defects using the etching solution and process for treating Si-substrates and SiGe-substrates using the etching solution
WO2013004081A1 (zh) * 2011-07-04 2013-01-10 上海先进半导体制造股份有限公司 复合集成传感器结构及其制造方法

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893228A (en) * 1972-10-02 1975-07-08 Motorola Inc Silicon pressure sensor
US3892606A (en) * 1973-06-28 1975-07-01 Ibm Method for forming silicon conductive layers utilizing differential etching rates
GB1480592A (en) * 1973-11-02 1977-07-20 Marconi Co Ltd Light emitting diodes
JPS5828731B2 (ja) * 1973-12-28 1983-06-17 テキサス インストルメンツ インコ−ポレ−テツド ゼツエンキバンジヨウヘノ シリコンソウサクセイホウホウ
US4050979A (en) * 1973-12-28 1977-09-27 Texas Instruments Incorporated Process for thinning silicon with special application to producing silicon on insulator
US3959045A (en) * 1974-11-18 1976-05-25 Varian Associates Process for making III-V devices
US3936329A (en) * 1975-02-03 1976-02-03 Texas Instruments Incorporated Integral honeycomb-like support of very thin single crystal slices
JPS6041458B2 (ja) * 1975-04-21 1985-09-17 ソニー株式会社 半導体装置の製造方法
US4198263A (en) * 1976-03-30 1980-04-15 Tokyo Shibaura Electric Co., Ltd. Mask for soft X-rays and method of manufacture
JPS5327300A (en) * 1976-08-27 1978-03-14 Yoshirou Fujii Lifesaving unit
US4142926A (en) * 1977-02-24 1979-03-06 Intel Corporation Self-aligning double polycrystalline silicon etching process
US4170512A (en) * 1977-05-26 1979-10-09 Massachusetts Institute Of Technology Method of manufacture of a soft-X-ray mask
JPS5839374B2 (ja) * 1978-12-26 1983-08-30 松下電器産業株式会社 半導体基板の処理方法
JPS56125100U (enExample) * 1980-02-26 1981-09-24
US4416053A (en) * 1980-03-24 1983-11-22 Hughes Aircraft Company Method of fabricating gallium arsenide burris FET structure for optical detection
US4319069A (en) * 1980-07-25 1982-03-09 Eastman Kodak Company Semiconductor devices having improved low-resistance contacts to p-type CdTe, and method of preparation
US4372803A (en) * 1980-09-26 1983-02-08 The United States Of America As Represented By The Secretary Of The Navy Method for etch thinning silicon devices
JPS58138033A (ja) * 1982-02-10 1983-08-16 Toshiba Corp 半導体基板及び半導体装置の製造方法
US4615762A (en) * 1985-04-30 1986-10-07 Rca Corporation Method for thinning silicon
US4888988A (en) * 1987-12-23 1989-12-26 Siemens-Bendix Automotive Electronics L.P. Silicon based mass airflow sensor and its fabrication method
US4870745A (en) * 1987-12-23 1989-10-03 Siemens-Bendix Automotive Electronics L.P. Methods of making silicon-based sensors
US4889590A (en) * 1989-04-27 1989-12-26 Motorola Inc. Semiconductor pressure sensor means and method
US5225377A (en) * 1991-05-03 1993-07-06 Honeywell Inc. Method for micromachining semiconductor material
DE4305297C2 (de) * 1993-02-20 1998-09-24 Telefunken Microelectron Strukturbeize für Halbleiter und deren Anwendung
US5968849A (en) * 1995-06-26 1999-10-19 Motorola, Inc. Method for pre-shaping a semiconductor substrate for polishing and structure
DE10248481B4 (de) * 2002-10-17 2006-04-27 Siltronic Ag Verfahren und Vorrichtung zur nasschemischen Behandlung von Silicium
US8278187B2 (en) * 2009-06-24 2012-10-02 Semiconductor Energy Laboratory Co., Ltd. Method for reprocessing semiconductor substrate by stepwise etching with at least two etching treatments
WO2010150671A1 (en) * 2009-06-24 2010-12-29 Semiconductor Energy Laboratory Co., Ltd. Method for reprocessing semiconductor substrate and method for manufacturing soi substrate
JP2011228651A (ja) * 2010-03-30 2011-11-10 Semiconductor Energy Lab Co Ltd 半導体基板の再生方法、再生半導体基板の作製方法、及びｓｏｉ基板の作製方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6703014A (enExample) * 1967-02-25 1968-08-26
US3616348A (en) * 1968-06-10 1971-10-26 Rca Corp Process for isolating semiconductor elements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1926132A1 (en) * 2006-11-23 2008-05-28 S.O.I.Tec Silicon on Insulator Technologies Chromium-free etching solution for Si-substrates and SiGe-substrates, method for revealing defects using the etching solution and process for treating Si-substrates and SiGe-substrates using the etching solution
KR100930294B1 (ko) * 2006-11-23 2009-12-09 에스.오.아이. 테크 실리콘 온 인슐레이터 테크놀로지스 Ｓｉ－기판 및 ＳｉＧｅ－기판을 위한 크롬이 없는 식각용액, 상기 식각 용액을 이용하여 결함을 나타내기위한방법 및 상기 식각 용액을 이용하여 Ｓｉ－기판 및ＳｉＧｅ－기판을 처리하기 위한 프로세스
US7635670B2 (en) 2006-11-23 2009-12-22 S.O.I.Tec Silicon On Insulator Technologies Chromium-free etching solution for si-substrates and uses therefor
WO2013004081A1 (zh) * 2011-07-04 2013-01-10 上海先进半导体制造股份有限公司 复合集成传感器结构及其制造方法

Also Published As

Publication number Publication date
JPS4936792B1 (enExample) 1974-10-03
US3767494A (en) 1973-10-23

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PE20 Patent expired after termination of 20 years