GB1295270A - - Google Patents

Info

Publication number
GB1295270A
GB1295270A GB1295270DA GB1295270A GB 1295270 A GB1295270 A GB 1295270A GB 1295270D A GB1295270D A GB 1295270DA GB 1295270 A GB1295270 A GB 1295270A
Authority
GB
United Kingdom
Prior art keywords
conductor
insulation
dec
forming
chemical removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1295270A publication Critical patent/GB1295270A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Insulated Conductors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

1295270 Direct connections MEKTRON NV 15 Dec 1969 [31 Dec 1968] 61071/69 Heading H2E A method of forming an electrical connection to a circuit element having a conductor 22 bonded between layers 20, 24 of thermosetting insulation comprises the chemical removal at 28 of a selected part of the insulation 20, the positioning of a conducting pin 32 through a hole stamped in the. conductor and layer 24 and heat fusing the head-34 of the pin to the exposed surface 30 of the conductor. The. invention is described with reference to forming a connection in a tape cable of the kind described in Specification 1,104,098 or to a flexible printed circuit. The chemical removal of insulation is as described. in Specification 1,104,097.
GB1295270D 1968-12-31 1969-12-15 Expired GB1295270A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78821968A 1968-12-31 1968-12-31

Publications (1)

Publication Number Publication Date
GB1295270A true GB1295270A (en) 1972-11-08

Family

ID=25143811

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1295270D Expired GB1295270A (en) 1968-12-31 1969-12-15

Country Status (4)

Country Link
BE (1) BE743759A (en)
DE (1) DE1965397A1 (en)
FR (1) FR2027447A1 (en)
GB (1) GB1295270A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2421447A1 (en) * 1978-03-31 1979-10-26 Vishay Intertechnology Inc PERFECTED PRECISION RESISTANCE AND ITS MANUFACTURING PROCESS

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004058691A1 (en) * 2004-12-06 2006-06-14 Robert Bosch Gmbh Vehicle e.g. aircraft, component`s contact section and printed circuit board`s conduction layer connecting arrangement, has contact section whose part is formed with projection over passage center, where projection overlaps with board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2421447A1 (en) * 1978-03-31 1979-10-26 Vishay Intertechnology Inc PERFECTED PRECISION RESISTANCE AND ITS MANUFACTURING PROCESS

Also Published As

Publication number Publication date
FR2027447A1 (en) 1970-09-25
BE743759A (en) 1970-05-28
DE1965397A1 (en) 1970-07-23

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees