JPS6484691A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS6484691A JPS6484691A JP24194787A JP24194787A JPS6484691A JP S6484691 A JPS6484691 A JP S6484691A JP 24194787 A JP24194787 A JP 24194787A JP 24194787 A JP24194787 A JP 24194787A JP S6484691 A JPS6484691 A JP S6484691A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- cable way
- insulating layer
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To improve reliability of a circuit and to conduct bonding securely by burying a cable way in an insulating layer to protrude the bonding section of the cable way from the insulating layer surface. CONSTITUTION:A cable way 4 is buried in an insulating layer 5 of a printed wiring board 21. A bonding layer 13 is formed on the bonding section of the cable way 4 protruding from the insulating layer 5. Since the insulation resistance through the adjacent cable way 4 is large and prevents short-circuit, breaking of wire due to flaws, etc., can be prevented. Moreover, capillary and pressure metal mold are bonded to the bonding layer 13 thus realizing secure bonding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24194787A JPS6484691A (en) | 1987-09-26 | 1987-09-26 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24194787A JPS6484691A (en) | 1987-09-26 | 1987-09-26 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6484691A true JPS6484691A (en) | 1989-03-29 |
Family
ID=17081936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24194787A Pending JPS6484691A (en) | 1987-09-26 | 1987-09-26 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6484691A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012212912A (en) * | 2012-06-20 | 2012-11-01 | Princo Corp | Structure of surface treatment layer of multilayer substrate and manufacturing method of the same |
-
1987
- 1987-09-26 JP JP24194787A patent/JPS6484691A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012212912A (en) * | 2012-06-20 | 2012-11-01 | Princo Corp | Structure of surface treatment layer of multilayer substrate and manufacturing method of the same |
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