JPS6484691A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS6484691A
JPS6484691A JP24194787A JP24194787A JPS6484691A JP S6484691 A JPS6484691 A JP S6484691A JP 24194787 A JP24194787 A JP 24194787A JP 24194787 A JP24194787 A JP 24194787A JP S6484691 A JPS6484691 A JP S6484691A
Authority
JP
Japan
Prior art keywords
bonding
cable way
insulating layer
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24194787A
Other languages
Japanese (ja)
Inventor
Junji Kaneko
Yoshiharu Kasai
Kaoru Tone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP24194787A priority Critical patent/JPS6484691A/en
Publication of JPS6484691A publication Critical patent/JPS6484691A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To improve reliability of a circuit and to conduct bonding securely by burying a cable way in an insulating layer to protrude the bonding section of the cable way from the insulating layer surface. CONSTITUTION:A cable way 4 is buried in an insulating layer 5 of a printed wiring board 21. A bonding layer 13 is formed on the bonding section of the cable way 4 protruding from the insulating layer 5. Since the insulation resistance through the adjacent cable way 4 is large and prevents short-circuit, breaking of wire due to flaws, etc., can be prevented. Moreover, capillary and pressure metal mold are bonded to the bonding layer 13 thus realizing secure bonding.
JP24194787A 1987-09-26 1987-09-26 Printed wiring board Pending JPS6484691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24194787A JPS6484691A (en) 1987-09-26 1987-09-26 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24194787A JPS6484691A (en) 1987-09-26 1987-09-26 Printed wiring board

Publications (1)

Publication Number Publication Date
JPS6484691A true JPS6484691A (en) 1989-03-29

Family

ID=17081936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24194787A Pending JPS6484691A (en) 1987-09-26 1987-09-26 Printed wiring board

Country Status (1)

Country Link
JP (1) JPS6484691A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012212912A (en) * 2012-06-20 2012-11-01 Princo Corp Structure of surface treatment layer of multilayer substrate and manufacturing method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012212912A (en) * 2012-06-20 2012-11-01 Princo Corp Structure of surface treatment layer of multilayer substrate and manufacturing method of the same

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