GB1294532A - Improvements in semiconductor devices - Google Patents

Improvements in semiconductor devices

Info

Publication number
GB1294532A
GB1294532A GB03907/70A GB1390770A GB1294532A GB 1294532 A GB1294532 A GB 1294532A GB 03907/70 A GB03907/70 A GB 03907/70A GB 1390770 A GB1390770 A GB 1390770A GB 1294532 A GB1294532 A GB 1294532A
Authority
GB
United Kingdom
Prior art keywords
pins
pressure
plate
heat spreader
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB03907/70A
Other languages
English (en)
Inventor
Carl Ingvar Boksjoe
Karl-Erik Olsson
Erich Spicar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Norden Holding AB
Original Assignee
ASEA AB
Allmanna Svenska Elektriska AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA AB, Allmanna Svenska Elektriska AB filed Critical ASEA AB
Publication of GB1294532A publication Critical patent/GB1294532A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB03907/70A 1969-03-24 1970-03-23 Improvements in semiconductor devices Expired GB1294532A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE04044/69A SE337263B (enExample) 1969-03-24 1969-03-24

Publications (1)

Publication Number Publication Date
GB1294532A true GB1294532A (en) 1972-11-01

Family

ID=20263401

Family Applications (1)

Application Number Title Priority Date Filing Date
GB03907/70A Expired GB1294532A (en) 1969-03-24 1970-03-23 Improvements in semiconductor devices

Country Status (6)

Country Link
JP (1) JPS4934026B1 (enExample)
CH (1) CH508983A (enExample)
DE (1) DE2013684A1 (enExample)
FR (1) FR2039914A5 (enExample)
GB (1) GB1294532A (enExample)
SE (1) SE337263B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1284503A1 (de) * 2001-08-13 2003-02-19 Abb Research Ltd. Leistungshalbleitermodul
EP1672692A1 (de) * 2004-12-16 2006-06-21 ABB Research Ltd Leistungshalbleiter-Modul
WO2012113584A1 (de) * 2011-02-22 2012-08-30 Infineon Technologies Bipolar Gmbh & Co. Kg Leistungshalbleitermodul
CN110233136A (zh) * 2018-03-06 2019-09-13 富士电机株式会社 冷却装置、半导体模块和车辆
CN120834081A (zh) * 2025-09-19 2025-10-24 武汉羿变电气有限公司 一种功率模块的封装结构

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
DE3010363C2 (de) * 1980-03-14 1987-02-12 Siemens AG, 1000 Berlin und 8000 München Gerätekombination für den Bergbau mit Bauelementen der Leistungselektronik
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
DE4131739C2 (de) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Kühleinrichtung für elektrische Bauelemente
DE4302816C2 (de) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1284503A1 (de) * 2001-08-13 2003-02-19 Abb Research Ltd. Leistungshalbleitermodul
EP1672692A1 (de) * 2004-12-16 2006-06-21 ABB Research Ltd Leistungshalbleiter-Modul
WO2012113584A1 (de) * 2011-02-22 2012-08-30 Infineon Technologies Bipolar Gmbh & Co. Kg Leistungshalbleitermodul
CN110233136A (zh) * 2018-03-06 2019-09-13 富士电机株式会社 冷却装置、半导体模块和车辆
CN120834081A (zh) * 2025-09-19 2025-10-24 武汉羿变电气有限公司 一种功率模块的封装结构

Also Published As

Publication number Publication date
SE337263B (enExample) 1971-08-02
JPS4934026B1 (enExample) 1974-09-11
CH508983A (de) 1971-06-15
DE2013684A1 (de) 1971-02-04
FR2039914A5 (enExample) 1971-01-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee