JPS4934026B1 - - Google Patents

Info

Publication number
JPS4934026B1
JPS4934026B1 JP45024173A JP2417370A JPS4934026B1 JP S4934026 B1 JPS4934026 B1 JP S4934026B1 JP 45024173 A JP45024173 A JP 45024173A JP 2417370 A JP2417370 A JP 2417370A JP S4934026 B1 JPS4934026 B1 JP S4934026B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45024173A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4934026B1 publication Critical patent/JPS4934026B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/231Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP45024173A 1969-03-24 1970-03-24 Pending JPS4934026B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE04044/69A SE337263B (enExample) 1969-03-24 1969-03-24

Publications (1)

Publication Number Publication Date
JPS4934026B1 true JPS4934026B1 (enExample) 1974-09-11

Family

ID=20263401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45024173A Pending JPS4934026B1 (enExample) 1969-03-24 1970-03-24

Country Status (6)

Country Link
JP (1) JPS4934026B1 (enExample)
CH (1) CH508983A (enExample)
DE (1) DE2013684A1 (enExample)
FR (1) FR2039914A5 (enExample)
GB (1) GB1294532A (enExample)
SE (1) SE337263B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
DE3010363C2 (de) * 1980-03-14 1987-02-12 Siemens AG, 1000 Berlin und 8000 München Gerätekombination für den Bergbau mit Bauelementen der Leistungselektronik
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
DE4131739C2 (de) * 1991-09-24 1996-12-19 Behr Industrietech Gmbh & Co Kühleinrichtung für elektrische Bauelemente
DE4302816C2 (de) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern
EP1284503A1 (de) * 2001-08-13 2003-02-19 Abb Research Ltd. Leistungshalbleitermodul
EP1672692B1 (de) * 2004-12-16 2015-01-07 ABB Research Ltd Leistungshalbleiter-Modul
DE102011004541B4 (de) * 2011-02-22 2014-07-17 Infineon Technologies Bipolar Gmbh & Co. Kg Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls
JP7067129B2 (ja) * 2018-03-06 2022-05-16 富士電機株式会社 冷却装置、半導体モジュールおよび車両
CN120834081B (zh) * 2025-09-19 2025-12-05 武汉羿变电气有限公司 一种功率模块的封装结构

Also Published As

Publication number Publication date
SE337263B (enExample) 1971-08-02
CH508983A (de) 1971-06-15
DE2013684A1 (de) 1971-02-04
FR2039914A5 (enExample) 1971-01-15
GB1294532A (en) 1972-11-01

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