GB1288954A - - Google Patents

Info

Publication number
GB1288954A
GB1288954A GB1288954DA GB1288954A GB 1288954 A GB1288954 A GB 1288954A GB 1288954D A GB1288954D A GB 1288954DA GB 1288954 A GB1288954 A GB 1288954A
Authority
GB
United Kingdom
Prior art keywords
metal
plastics
plastics material
sintered
end plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681803307 external-priority patent/DE1803307A1/de
Priority claimed from DE19681816412 external-priority patent/DE1816412A1/de
Application filed filed Critical
Publication of GB1288954A publication Critical patent/GB1288954A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082—Mechanical anchoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulding By Coating Moulds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
GB1288954D 1968-10-16 1969-10-15 Expired GB1288954A (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681803307 DE1803307A1 (de) 1968-10-16 1968-10-16 Verfahren zum Herstellen einer festen Verbindung zwischen einem Kunststoff- und einem Metallkoerper
DE19681816412 DE1816412A1 (de) 1968-12-21 1968-12-21 Metall-Kunststoff-Verbundwerkstoff und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
GB1288954A true GB1288954A (enrdf_load_stackoverflow) 1972-09-13

Family

ID=25756272

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1288954D Expired GB1288954A (enrdf_load_stackoverflow) 1968-10-16 1969-10-15

Country Status (3)

Country Link
JP (1) JPS4826675B1 (enrdf_load_stackoverflow)
FR (1) FR2020839A1 (enrdf_load_stackoverflow)
GB (1) GB1288954A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2810416A1 (de) * 1978-03-10 1979-09-13 Licentia Gmbh Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2810416A1 (de) * 1978-03-10 1979-09-13 Licentia Gmbh Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung

Also Published As

Publication number Publication date
JPS4826675B1 (enrdf_load_stackoverflow) 1973-08-14
FR2020839A1 (enrdf_load_stackoverflow) 1970-07-17

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees