FR2020839A1 - - Google Patents

Info

Publication number
FR2020839A1
FR2020839A1 FR6935372A FR6935372A FR2020839A1 FR 2020839 A1 FR2020839 A1 FR 2020839A1 FR 6935372 A FR6935372 A FR 6935372A FR 6935372 A FR6935372 A FR 6935372A FR 2020839 A1 FR2020839 A1 FR 2020839A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6935372A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681803307 external-priority patent/DE1803307A1/de
Priority claimed from DE19681816412 external-priority patent/DE1816412A1/de
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2020839A1 publication Critical patent/FR2020839A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082—Mechanical anchoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Moulding By Coating Moulds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
FR6935372A 1968-10-16 1969-10-15 Withdrawn FR2020839A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681803307 DE1803307A1 (de) 1968-10-16 1968-10-16 Verfahren zum Herstellen einer festen Verbindung zwischen einem Kunststoff- und einem Metallkoerper
DE19681816412 DE1816412A1 (de) 1968-12-21 1968-12-21 Metall-Kunststoff-Verbundwerkstoff und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
FR2020839A1 true FR2020839A1 (fr) 1970-07-17

Family

ID=25756272

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6935372A Withdrawn FR2020839A1 (fr) 1968-10-16 1969-10-15

Country Status (3)

Country Link
JP (1) JPS4826675B1 (fr)
FR (1) FR2020839A1 (fr)
GB (1) GB1288954A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2810416C2 (de) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement mit Kunststoffummantelung

Also Published As

Publication number Publication date
GB1288954A (fr) 1972-09-13
JPS4826675B1 (fr) 1973-08-14

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Legal Events

Date Code Title Description
ST Notification of lapse