GB1288954A - - Google Patents

Info

Publication number
GB1288954A
GB1288954A GB1288954DA GB1288954A GB 1288954 A GB1288954 A GB 1288954A GB 1288954D A GB1288954D A GB 1288954DA GB 1288954 A GB1288954 A GB 1288954A
Authority
GB
United Kingdom
Prior art keywords
metal
plastics
plastics material
sintered
end plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681803307 external-priority patent/DE1803307A1/en
Priority claimed from DE19681816412 external-priority patent/DE1816412A1/en
Application filed filed Critical
Publication of GB1288954A publication Critical patent/GB1288954A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082—Mechanical anchoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Moulding By Coating Moulds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

1288954 Making electric components; jointing SIEMENS AG 15 Oct 1969 [16 Oct 1968 21 Dec 1968] 50774/69 Headings B3A and B3V [Also in Division H1] A method of making a metallic seal in a hollow plastics body 11, Fig. 1, comprises introducing a porous compacted metal powder body 12 into the plastics body 11 so that plastics material penetrates the pores of the metal body 12 but leaves part of the surface of the body 12 free of the plastics material, and sealing a metal cover 13 on the free surface of the metal body 12. The bodies 11, 12 may be placed in a mould and pressure applied at a temperature above the melting temperature of the plastics material, to cause the plastics material to penetrate the sintered metal, which may have different pore sizes at different points. Alternatively, the plastics material is moulded on to the porous metal. The sintered metal may be iron, copper or nickel and the cover 13 secured by solder. In another construction, Fig. 2, a chamber for a semi-conductor (not shown) is formed by embedding sintered metal rings 22, 22<SP>1</SP> in a plastics ring 21 and soldering or welding metal discs 23, 23<SP>1</SP> to the metal rings 22, 22<SP>1</SP>. In another housing for a semiconductor 60, Fig. 6, the semi-conductor is held between sintered copper end plates 61 by a spring 67 and a contact plate 68. The end plates 61 have central, projecting zones 63 of lower packing degree surrounded by the plastics material of housing rings 65 which have a centring ring 66 and are welded together ultrasonically or by heat treatment. Metal covers (not shown), which may act as terminals, are soldered to the end plates. Two sealed plastics bodies may be joined together by soldering, welding or screwing.
GB1288954D 1968-10-16 1969-10-15 Expired GB1288954A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681803307 DE1803307A1 (en) 1968-10-16 1968-10-16 Method for producing a solid connection between a plastic and a metal body
DE19681816412 DE1816412A1 (en) 1968-12-21 1968-12-21 Thermoplastic coated metal

Publications (1)

Publication Number Publication Date
GB1288954A true GB1288954A (en) 1972-09-13

Family

ID=25756272

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1288954D Expired GB1288954A (en) 1968-10-16 1969-10-15

Country Status (3)

Country Link
JP (1) JPS4826675B1 (en)
FR (1) FR2020839A1 (en)
GB (1) GB1288954A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2810416A1 (en) * 1978-03-10 1979-09-13 Licentia Gmbh DISC-SHAPED SEMICONDUCTOR COMPONENT WITH HIGH EFFICIENCY WITH PLASTIC COATING

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2810416A1 (en) * 1978-03-10 1979-09-13 Licentia Gmbh DISC-SHAPED SEMICONDUCTOR COMPONENT WITH HIGH EFFICIENCY WITH PLASTIC COATING

Also Published As

Publication number Publication date
JPS4826675B1 (en) 1973-08-14
FR2020839A1 (en) 1970-07-17

Similar Documents

Publication Publication Date Title
JP3059560B2 (en) Method for manufacturing semiconductor device and molding material used therefor
US3598896A (en) Encapsulated semiconductor device with parts formed of sinter metal and plastic
GB1391383A (en) Method of fabricating an hermetic cover and sealing ring unit for a container and selaing the container
US3422320A (en) Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices
GB1410813A (en) Housings for electrical components
GB1288954A (en)
US3896542A (en) Method of sealing electrical component envelopes
US3226804A (en) Method of soldering peltier devices
US2965962A (en) Hermetic seal and method of making the same
US3720996A (en) Process for the manufacture of a rigid connection between a synthetic body and a metal body
US2941688A (en) Encapsulation of electronic component and method of making the same
US1999785A (en) Method of uniting parts
GB1430357A (en) Method of bonding magnets and permanent magnets produced by the method
US3733691A (en) Process for making semiconductor devices
US2819961A (en) Process for connecting a tantalum electrode pin to an electrode body
GB1484641A (en) Method of bonding sintered iron containing articles
RU2037280C1 (en) Sealed micromodule case and its manufacturing process
JPS5549857A (en) Enclosed alkaline battery
GB1478847A (en) Method of encapsulating an electric component
JPH01173787A (en) Hermetically sealed vessel and manufacture thereof
US3544308A (en) Method of producing asbestos-felt bodies having elastic properties
ES418618A1 (en) A method for welding a metal current collector with a one-pile terminal metal plate. (Machine-translation by Google Translate, not legally binding)
GB1361176A (en) Electrical devices
SU465272A1 (en) Method of making sintered products
JPS5456191A (en) Sealing terminal and its manufacturing process

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees