GB1478847A - Method of encapsulating an electric component - Google Patents
Method of encapsulating an electric componentInfo
- Publication number
- GB1478847A GB1478847A GB3671173A GB3671173A GB1478847A GB 1478847 A GB1478847 A GB 1478847A GB 3671173 A GB3671173 A GB 3671173A GB 3671173 A GB3671173 A GB 3671173A GB 1478847 A GB1478847 A GB 1478847A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hole
- solder
- gold
- tool
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
Abstract
1478847 Printed circuits LUCAS INDUSTRIES Ltd 9 Oct 1974 [2 Aug 1973] 36711/73 Heading H1R An electrical component in the form of a thin film printed circuit assembly 10, (Fig. 1) is applied to a ceramic substrate 11 and interconnected over leads 12 to a thick film circuit deposited on the substrate, which also carries a surrounding thick film metallic land 13 crated with solder. A gold plated dished metal flanged lid 14 with a through hole 15 is urged into edge contact with the land by a sucker 17 on an arm of a clamping device (not shown) and the flanges are heated to solder on the lid without flux and build up a fillet of solder. The assembly is then placed in an atmosphere of helium and evacuated through the hole to allow the internal space to fill with helium; after which it is sealed by passing a wire through a bore of tool 20 (Fig. 2) and heating into a sealant ball bonding to the lid. Alternatively a gold ball may be located over the hole and welded by heat and pressure from a ram; or a tapered gold wire may be inserted in the hole through a bore of a tool and rotated to form a friction weld (Fig. 3 not shown) or a gold foil may be applied to the hole by suction through a heated tool, and rotated to form a friction weld.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3671173A GB1478847A (en) | 1974-10-09 | 1974-10-09 | Method of encapsulating an electric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3671173A GB1478847A (en) | 1974-10-09 | 1974-10-09 | Method of encapsulating an electric component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1478847A true GB1478847A (en) | 1977-07-06 |
Family
ID=10390570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3671173A Expired GB1478847A (en) | 1974-10-09 | 1974-10-09 | Method of encapsulating an electric component |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1478847A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2715001A1 (en) * | 1994-01-12 | 1995-07-13 | Fujitsu Ltd | Hybrid integrated circuit module. |
| WO2011120164A1 (en) * | 2010-03-31 | 2011-10-06 | Ats Automation Tooling Systems Inc. | One-piece junction box |
-
1974
- 1974-10-09 GB GB3671173A patent/GB1478847A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2715001A1 (en) * | 1994-01-12 | 1995-07-13 | Fujitsu Ltd | Hybrid integrated circuit module. |
| WO2011120164A1 (en) * | 2010-03-31 | 2011-10-06 | Ats Automation Tooling Systems Inc. | One-piece junction box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |