GB1286433A - Improvements in or relating to the production of metal layers - Google Patents

Improvements in or relating to the production of metal layers

Info

Publication number
GB1286433A
GB1286433A GB23729/71A GB2372971A GB1286433A GB 1286433 A GB1286433 A GB 1286433A GB 23729/71 A GB23729/71 A GB 23729/71A GB 2372971 A GB2372971 A GB 2372971A GB 1286433 A GB1286433 A GB 1286433A
Authority
GB
United Kingdom
Prior art keywords
layers
lacquer
gold
thermal decomposition
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23729/71A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1286433A publication Critical patent/GB1286433A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
GB23729/71A 1970-03-13 1971-04-19 Improvements in or relating to the production of metal layers Expired GB1286433A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702012110 DE2012110A1 (de) 1970-03-13 1970-03-13 Verfahren zum Herstellen einer Mehrlagenmetallisierung an elektrischen Bauelementen

Publications (1)

Publication Number Publication Date
GB1286433A true GB1286433A (en) 1972-08-23

Family

ID=5765052

Family Applications (1)

Application Number Title Priority Date Filing Date
GB23729/71A Expired GB1286433A (en) 1970-03-13 1971-04-19 Improvements in or relating to the production of metal layers

Country Status (7)

Country Link
US (1) US3808041A (enExample)
AT (1) AT318009B (enExample)
DE (1) DE2012110A1 (enExample)
FR (1) FR2081913B1 (enExample)
GB (1) GB1286433A (enExample)
NL (1) NL7102911A (enExample)
SE (1) SE359122B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233671A (en) * 1989-04-27 1991-01-16 Amp Akzo J V Inc Simultaneously firing two heat decomposable layers

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation
US4526807A (en) * 1984-04-27 1985-07-02 General Electric Company Method for deposition of elemental metals and metalloids on substrates
US4810463A (en) * 1986-09-12 1989-03-07 Syracuse University Process for forming sintered ceramic articles
US4789645A (en) * 1987-04-20 1988-12-06 Eaton Corporation Method for fabrication of monolithic integrated circuits
JPH05206134A (ja) * 1991-11-12 1993-08-13 Nec Corp 半導体装置とその製造方法
US20060108672A1 (en) * 2004-11-24 2006-05-25 Brennan John M Die bonded device and method for transistor packages

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694016A (en) * 1950-06-01 1954-11-09 Du Pont Method of producing coated ceramic capacitor
US2805965A (en) * 1952-09-25 1957-09-10 Sprague Electric Co Method for producing deposits of metal compounds on metal
US3067315A (en) * 1960-02-08 1962-12-04 Gen Electric Multi-layer film heaters in strip form
GB930091A (en) * 1960-06-24 1963-07-03 Mond Nickel Co Ltd Improvements relating to the production of semi-conductor devices
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
US3460003A (en) * 1967-01-30 1969-08-05 Corning Glass Works Metallized semiconductor device with fired-on glaze consisting of 25-35% pbo,10-15% b2o3,5-10% al2o3,and the balance sio2
US3616348A (en) * 1968-06-10 1971-10-26 Rca Corp Process for isolating semiconductor elements
US3549415A (en) * 1968-07-15 1970-12-22 Zenith Radio Corp Method of making multilayer ceramic capacitors
US3622322A (en) * 1968-09-11 1971-11-23 Rca Corp Photographic method for producing a metallic pattern with a metal resinate
US3635759A (en) * 1969-04-04 1972-01-18 Gulton Ind Inc Method of eliminating voids in ceramic bodies

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233671A (en) * 1989-04-27 1991-01-16 Amp Akzo J V Inc Simultaneously firing two heat decomposable layers
GB2233671B (en) * 1989-04-27 1993-05-26 Amp Akzo J V Inc Process for producing a metal seed layer on a substrate

Also Published As

Publication number Publication date
AT318009B (de) 1974-09-25
FR2081913B1 (enExample) 1974-09-06
SE359122B (enExample) 1973-08-20
DE2012110A1 (de) 1971-09-23
NL7102911A (enExample) 1971-09-15
US3808041A (en) 1974-04-30
FR2081913A1 (enExample) 1971-12-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees