SE359122B - - Google Patents

Info

Publication number
SE359122B
SE359122B SE03321/71A SE332171A SE359122B SE 359122 B SE359122 B SE 359122B SE 03321/71 A SE03321/71 A SE 03321/71A SE 332171 A SE332171 A SE 332171A SE 359122 B SE359122 B SE 359122B
Authority
SE
Sweden
Application number
SE03321/71A
Inventor
G Rosenberger
H Soehlbrand
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE359122B publication Critical patent/SE359122B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
SE03321/71A 1970-03-13 1971-03-15 SE359122B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702012110 DE2012110A1 (de) 1970-03-13 1970-03-13 Verfahren zum Herstellen einer Mehrlagenmetallisierung an elektrischen Bauelementen

Publications (1)

Publication Number Publication Date
SE359122B true SE359122B (xx) 1973-08-20

Family

ID=5765052

Family Applications (1)

Application Number Title Priority Date Filing Date
SE03321/71A SE359122B (xx) 1970-03-13 1971-03-15

Country Status (7)

Country Link
US (1) US3808041A (xx)
AT (1) AT318009B (xx)
DE (1) DE2012110A1 (xx)
FR (1) FR2081913B1 (xx)
GB (1) GB1286433A (xx)
NL (1) NL7102911A (xx)
SE (1) SE359122B (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation
US4526807A (en) * 1984-04-27 1985-07-02 General Electric Company Method for deposition of elemental metals and metalloids on substrates
US4810463A (en) * 1986-09-12 1989-03-07 Syracuse University Process for forming sintered ceramic articles
US4789645A (en) * 1987-04-20 1988-12-06 Eaton Corporation Method for fabrication of monolithic integrated circuits
GB8909729D0 (en) * 1989-04-27 1990-04-25 Ici Plc Compositions
JPH05206134A (ja) * 1991-11-12 1993-08-13 Nec Corp 半導体装置とその製造方法
US20060108672A1 (en) * 2004-11-24 2006-05-25 Brennan John M Die bonded device and method for transistor packages

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694016A (en) * 1950-06-01 1954-11-09 Du Pont Method of producing coated ceramic capacitor
US2805965A (en) * 1952-09-25 1957-09-10 Sprague Electric Co Method for producing deposits of metal compounds on metal
US3067315A (en) * 1960-02-08 1962-12-04 Gen Electric Multi-layer film heaters in strip form
GB930091A (en) * 1960-06-24 1963-07-03 Mond Nickel Co Ltd Improvements relating to the production of semi-conductor devices
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
US3460003A (en) * 1967-01-30 1969-08-05 Corning Glass Works Metallized semiconductor device with fired-on glaze consisting of 25-35% pbo,10-15% b2o3,5-10% al2o3,and the balance sio2
US3616348A (en) * 1968-06-10 1971-10-26 Rca Corp Process for isolating semiconductor elements
US3549415A (en) * 1968-07-15 1970-12-22 Zenith Radio Corp Method of making multilayer ceramic capacitors
US3622322A (en) * 1968-09-11 1971-11-23 Rca Corp Photographic method for producing a metallic pattern with a metal resinate
US3635759A (en) * 1969-04-04 1972-01-18 Gulton Ind Inc Method of eliminating voids in ceramic bodies

Also Published As

Publication number Publication date
GB1286433A (en) 1972-08-23
FR2081913B1 (xx) 1974-09-06
DE2012110A1 (de) 1971-09-23
NL7102911A (xx) 1971-09-15
AT318009B (de) 1974-09-25
US3808041A (en) 1974-04-30
FR2081913A1 (xx) 1971-12-10

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