GB1279741A - Electrically conductive stripe - Google Patents

Electrically conductive stripe

Info

Publication number
GB1279741A
GB1279741A GB036/70A GB13670A GB1279741A GB 1279741 A GB1279741 A GB 1279741A GB 036/70 A GB036/70 A GB 036/70A GB 13670 A GB13670 A GB 13670A GB 1279741 A GB1279741 A GB 1279741A
Authority
GB
United Kingdom
Prior art keywords
copper
silicon
aluminium
tracks
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB036/70A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1279741A publication Critical patent/GB1279741A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/927—Electromigration resistant metallization
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Conductive Materials (AREA)
GB036/70A 1969-01-15 1970-01-01 Electrically conductive stripe Expired GB1279741A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79137169A 1969-01-15 1969-01-15

Publications (1)

Publication Number Publication Date
GB1279741A true GB1279741A (en) 1972-06-28

Family

ID=25153531

Family Applications (1)

Application Number Title Priority Date Filing Date
GB036/70A Expired GB1279741A (en) 1969-01-15 1970-01-01 Electrically conductive stripe

Country Status (10)

Country Link
US (1) US3725309A (enExample)
JP (1) JPS4922397B1 (enExample)
BE (1) BE744429A (enExample)
CA (1) CA939077A (enExample)
CH (1) CH502050A (enExample)
DE (1) DE2001515C3 (enExample)
FR (1) FR2030151B1 (enExample)
GB (1) GB1279741A (enExample)
NL (2) NL167049C (enExample)
SE (1) SE355475B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2131624A (en) * 1982-12-09 1984-06-20 Standard Telephones Cables Ltd Thick film circuits
US4533603A (en) * 1981-11-16 1985-08-06 Tdk Electronics Co., Ltd. Magnetic recording medium

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3848330A (en) * 1972-06-01 1974-11-19 Motorola Inc Electromigration resistant semiconductor contacts and the method of producing same
US3928027A (en) * 1973-03-27 1975-12-23 Us Energy Nonswelling alloy
US3924264A (en) * 1973-05-17 1975-12-02 Ibm Schottky barrier device and circuit application
US4097663A (en) * 1976-01-29 1978-06-27 Stauffer Chemical Company Low fusion copolymer comprising vinyl chloride, vinyl acetate, and bis(hydrocarbyl)vinylphosphonate
US4017890A (en) * 1975-10-24 1977-04-12 International Business Machines Corporation Intermetallic compound layer in thin films for improved electromigration resistance
US3987216A (en) * 1975-12-31 1976-10-19 International Business Machines Corporation Method of forming schottky barrier junctions having improved barrier height
JPS5459080A (en) * 1977-10-19 1979-05-12 Nec Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS5731144A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Mamufacture of semiconductor device
US4335506A (en) * 1980-08-04 1982-06-22 International Business Machines Corporation Method of forming aluminum/copper alloy conductors
US4373966A (en) * 1981-04-30 1983-02-15 International Business Machines Corporation Forming Schottky barrier diodes by depositing aluminum silicon and copper or binary alloys thereof and alloy-sintering
US4349411A (en) * 1981-10-05 1982-09-14 Bell Telephone Laboratories, Incorporated Etch procedure for aluminum alloy
US4393096A (en) * 1981-11-16 1983-07-12 International Business Machines Corporation Aluminum-copper alloy evaporated films with low via resistance
US4525734A (en) * 1983-03-21 1985-06-25 Syracuse University Hydrogen charged thin film conductor
US4489482A (en) * 1983-06-06 1984-12-25 Fairchild Camera & Instrument Corp. Impregnation of aluminum interconnects with copper
US4549036A (en) * 1984-07-23 1985-10-22 Reichbach Morris M Circular integrated circuit package
EP0261846B1 (en) * 1986-09-17 1992-12-02 Fujitsu Limited Method of forming a metallization film containing copper on the surface of a semiconductor device
US5019891A (en) * 1988-01-20 1991-05-28 Hitachi, Ltd. Semiconductor device and method of fabricating the same
JP2680468B2 (ja) * 1989-07-01 1997-11-19 株式会社東芝 半導体装置および半導体装置の製造方法
US5243221A (en) * 1989-10-25 1993-09-07 At&T Bell Laboratories Aluminum metallization doped with iron and copper to prevent electromigration
US5554889A (en) * 1992-04-03 1996-09-10 Motorola, Inc. Structure and method for metallization of semiconductor devices
EP0606761A3 (en) * 1992-12-28 1995-02-08 Kawasaki Steel Co Semiconductor device and its manufacturing method.
JP3349332B2 (ja) 1995-04-28 2002-11-25 インターナショナル・ビジネス・マシーンズ・コーポレーション 反射式空間光変調素子配列及びその形成方法
JP4083921B2 (ja) * 1998-05-29 2008-04-30 株式会社東芝 半導体装置の製造方法
US6955980B2 (en) * 2002-08-30 2005-10-18 Texas Instruments Incorporated Reducing the migration of grain boundaries
US20100307568A1 (en) * 2009-06-04 2010-12-09 First Solar, Inc. Metal barrier-doped metal contact layer
US11738537B2 (en) 2013-10-30 2023-08-29 San Diego Gas & Electric Company, c/o Sempra Energy Nonconductive films for lighter than air balloons
US20150118460A1 (en) 2013-10-30 2015-04-30 San Diego Gas & Electric company c/o Sempra Energy Nonconductive films for lighter than air balloons

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1658757A (en) * 1926-03-19 1928-02-07 Gen Electric Metal composition
US2569149A (en) * 1945-10-19 1951-09-25 Joseph B Brennan Bimetallic structure
US2706680A (en) * 1952-02-27 1955-04-19 Aluminum Co Of America Aluminum base alloy
US3018198A (en) * 1959-08-13 1962-01-23 Resistance Products Company Film resistor and method of making same
US3318758A (en) * 1963-02-18 1967-05-09 Tellite Corp Method of making a printed circuit board which includes low temperature saturation and the product
US3307978A (en) * 1964-02-17 1967-03-07 Dow Chemical Co Process for preparing high strength fabricated articles from aluminum-base alloys containing copper
US3359141A (en) * 1964-02-18 1967-12-19 Pechiney Prod Chimiques Sa Electrical conductors of aluminum and methods for production of same
FR1449426A (fr) * 1964-10-10 1966-08-12 Nippon Electric Co Dispositif semi-conducteurs utilisant une couche d'un composé d'aluminium et d'or
US3360349A (en) * 1965-04-01 1967-12-26 Sperry Rand Corp Copper layer bonded to a non-conductive layer by means of a copper alloy
NL6617141A (enExample) * 1966-02-11 1967-08-14 Siemens Ag
US3474530A (en) * 1967-02-03 1969-10-28 Ibm Mass production of electronic devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533603A (en) * 1981-11-16 1985-08-06 Tdk Electronics Co., Ltd. Magnetic recording medium
GB2131624A (en) * 1982-12-09 1984-06-20 Standard Telephones Cables Ltd Thick film circuits

Also Published As

Publication number Publication date
DE2001515B2 (de) 1979-08-09
JPS4922397B1 (enExample) 1974-06-07
DE2001515C3 (de) 1984-06-20
US3725309A (en) 1973-04-03
NL167049B (nl) 1981-05-15
FR2030151B1 (enExample) 1974-02-01
NL87258C (enExample)
DE2001515A1 (de) 1970-08-27
CA939077A (en) 1973-12-25
SE355475B (enExample) 1973-04-16
CH502050A (de) 1971-01-15
BE744429A (fr) 1970-07-14
NL167049C (nl) 1981-10-15
FR2030151A1 (enExample) 1970-10-30
NL6918641A (enExample) 1970-07-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee