GB1278499A - Improved process for polishing oxidizable surfaces - Google Patents

Improved process for polishing oxidizable surfaces

Info

Publication number
GB1278499A
GB1278499A GB4152969A GB4152969A GB1278499A GB 1278499 A GB1278499 A GB 1278499A GB 4152969 A GB4152969 A GB 4152969A GB 4152969 A GB4152969 A GB 4152969A GB 1278499 A GB1278499 A GB 1278499A
Authority
GB
United Kingdom
Prior art keywords
oxide
acid
oxidizing agent
gallium
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4152969A
Other languages
English (en)
Inventor
James Claude Boatman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1278499A publication Critical patent/GB1278499A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
GB4152969A 1968-10-17 1969-08-20 Improved process for polishing oxidizable surfaces Expired GB1278499A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76853768A 1968-10-17 1968-10-17

Publications (1)

Publication Number Publication Date
GB1278499A true GB1278499A (en) 1972-06-21

Family

ID=25082774

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4152969A Expired GB1278499A (en) 1968-10-17 1969-08-20 Improved process for polishing oxidizable surfaces

Country Status (5)

Country Link
JP (1) JPS493022B1 (de)
DE (1) DE1951336A1 (de)
FR (1) FR2020888A1 (de)
GB (1) GB1278499A (de)
NL (1) NL6914998A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1898454A2 (de) 2006-09-07 2008-03-12 Siltronic AG Alkalin-Ätzlösung für einen Halbleiter-Wafer und Alkanin-Ätzverfahren
EP1979431A1 (de) * 2006-02-01 2008-10-15 Cabot Microelectronics Corporation Zusammensetzungen und verfahren für chemisch-mechanisches polieren von phasenwechsellegierungen

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007061084A1 (de) 2007-12-19 2009-07-02 Federal-Mogul Sealing Systems Gmbh Metallische Flachdichtung und Herstellverfahren

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1979431A1 (de) * 2006-02-01 2008-10-15 Cabot Microelectronics Corporation Zusammensetzungen und verfahren für chemisch-mechanisches polieren von phasenwechsellegierungen
EP1979431A4 (de) * 2006-02-01 2009-04-29 Cabot Microelectronics Corp Zusammensetzungen und verfahren für chemisch-mechanisches polieren von phasenwechsellegierungen
EP1898454A2 (de) 2006-09-07 2008-03-12 Siltronic AG Alkalin-Ätzlösung für einen Halbleiter-Wafer und Alkanin-Ätzverfahren
EP1898454A3 (de) * 2006-09-07 2008-06-04 Siltronic AG Alkalin-Ätzlösung für einen Halbleiter-Wafer und Alkanin-Ätzverfahren
US7780868B2 (en) 2006-09-07 2010-08-24 Siltronic Ag Alkaline etching solution for semiconductor wafers and alkaline etching method

Also Published As

Publication number Publication date
JPS493022B1 (de) 1974-01-24
DE1951336A1 (de) 1970-04-23
NL6914998A (de) 1970-04-21
FR2020888A1 (de) 1970-07-17

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees