GB1275428A - Sputtering apparatus and method - Google Patents
Sputtering apparatus and methodInfo
- Publication number
- GB1275428A GB1275428A GB27428/69A GB2742869A GB1275428A GB 1275428 A GB1275428 A GB 1275428A GB 27428/69 A GB27428/69 A GB 27428/69A GB 2742869 A GB2742869 A GB 2742869A GB 1275428 A GB1275428 A GB 1275428A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- elements
- sputtered
- source
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 2
- 229910017532 Cu-Be Inorganic materials 0.000 abstract 1
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- 239000012300 argon atmosphere Substances 0.000 abstract 1
- 238000005513 bias potential Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 239000002826 coolant Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910000889 permalloy Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73359468A | 1968-05-31 | 1968-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1275428A true GB1275428A (en) | 1972-05-24 |
Family
ID=24948299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB27428/69A Expired GB1275428A (en) | 1968-05-31 | 1969-05-30 | Sputtering apparatus and method |
Country Status (6)
Country | Link |
---|---|
US (1) | US3616402A (enrdf_load_stackoverflow) |
BE (1) | BE733724A (enrdf_load_stackoverflow) |
DE (1) | DE1927253A1 (enrdf_load_stackoverflow) |
FR (1) | FR2009759A1 (enrdf_load_stackoverflow) |
GB (1) | GB1275428A (enrdf_load_stackoverflow) |
NL (1) | NL6908267A (enrdf_load_stackoverflow) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2253769C3 (de) * | 1972-11-02 | 1979-07-12 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Kathodenzerstäubungsanlage mit kontinuierlichem Substratdurchlauf |
US4125446A (en) * | 1977-08-15 | 1978-11-14 | Airco, Inc. | Controlled reflectance of sputtered aluminum layers |
US4313815A (en) * | 1978-04-07 | 1982-02-02 | Varian Associates, Inc. | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
US4356073A (en) * | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4834856A (en) * | 1988-01-21 | 1989-05-30 | Wehner Gottfried K | Method and apparatus for sputtering a superconductor onto a substrate |
US4911810A (en) * | 1988-06-21 | 1990-03-27 | Brown University | Modular sputtering apparatus |
US5798029A (en) * | 1994-04-22 | 1998-08-25 | Applied Materials, Inc. | Target for sputtering equipment |
DE19623359A1 (de) * | 1995-08-17 | 1997-02-20 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
US5830272A (en) * | 1995-11-07 | 1998-11-03 | Sputtered Films, Inc. | System for and method of providing a controlled deposition on wafers |
JP2001003166A (ja) * | 1999-04-23 | 2001-01-09 | Nippon Sheet Glass Co Ltd | 基体表面に被膜を被覆する方法およびその方法による基体 |
US20030209423A1 (en) * | 2001-03-27 | 2003-11-13 | Christie David J. | System for driving multiple magnetrons with multiple phase ac |
US9175383B2 (en) * | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
MY177448A (en) * | 2008-05-01 | 2020-09-15 | First Solar Inc | Transparent conductive materials including cadmium stannate |
JP2013163856A (ja) * | 2012-02-13 | 2013-08-22 | Tokyo Electron Ltd | スパッタ装置 |
CN104831247B (zh) * | 2015-04-15 | 2017-06-06 | 赫得纳米科技(昆山)有限公司 | 水平连续式磁控溅射镀膜机在线面板恒温加热装置 |
CN106884150B (zh) * | 2017-04-24 | 2023-06-09 | 爱瑞德科技(大连)有限公司 | 一种悬浮阳极及带有悬浮阳极的磁控溅射装置 |
-
1968
- 1968-05-31 US US733594A patent/US3616402A/en not_active Expired - Lifetime
-
1969
- 1969-05-28 BE BE733724D patent/BE733724A/xx unknown
- 1969-05-29 DE DE19691927253 patent/DE1927253A1/de active Pending
- 1969-05-30 FR FR6917838A patent/FR2009759A1/fr not_active Withdrawn
- 1969-05-30 NL NL6908267A patent/NL6908267A/xx unknown
- 1969-05-30 GB GB27428/69A patent/GB1275428A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL6908267A (enrdf_load_stackoverflow) | 1969-12-02 |
FR2009759A1 (enrdf_load_stackoverflow) | 1970-02-06 |
US3616402A (en) | 1971-10-26 |
DE1927253A1 (de) | 1969-12-04 |
BE733724A (enrdf_load_stackoverflow) | 1969-11-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1275428A (en) | Sputtering apparatus and method | |
US2160799A (en) | Electron discharge device | |
US3985635A (en) | Apparatus for concurrently sputtering different materials | |
US4159909A (en) | Cathode target material compositions for magnetic sputtering | |
US3576729A (en) | Sputtering methods and apparatus | |
US3305473A (en) | Triode sputtering apparatus for depositing uniform coatings | |
US4219397A (en) | Magnetron sputter apparatus | |
AU1468283A (en) | Magnetron cathode sputtering system | |
DE4042287A1 (de) | Verfahren und vorrichtung zum reaktiven beschichten eines substrats | |
US3708418A (en) | Apparatus for etching of thin layers of material by ion bombardment | |
Colaleo et al. | Diamond-like carbon for the fast timing MPGD | |
US3526584A (en) | Method of providing a field free region above a substrate during sputter-depositing thereon | |
GB1270496A (en) | Ion source for slow-ion sputtering | |
GB1401229A (en) | Multibeam cathode ray tube | |
JPH08209343A (ja) | 平面マグネトロン・スパッタリングの方法と装置 | |
US3728246A (en) | Device for applying thin films to articles | |
US2575372A (en) | Cold cathode gaseous discharge device | |
US3463715A (en) | Method of cathodically sputtering a layer of silicon having a reduced resistivity | |
US3846662A (en) | Alpha-numberic display type electron discharge device | |
JP2827306B2 (ja) | 画像表示装置 | |
US4270068A (en) | Fluorescent display device | |
US2945124A (en) | Formation of electrical fields | |
US3858073A (en) | Plane multi-digit type electric discharge display devices | |
GB1115055A (en) | Film deposition in an evacuated chamber | |
JPH01162762A (ja) | スパッタリング装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CSNS | Application of which complete specification have been accepted and published, but patent is not sealed |