GB1270316A - Integrated semiconductor devices - Google Patents

Integrated semiconductor devices

Info

Publication number
GB1270316A
GB1270316A GB42929/69A GB4292969A GB1270316A GB 1270316 A GB1270316 A GB 1270316A GB 42929/69 A GB42929/69 A GB 42929/69A GB 4292969 A GB4292969 A GB 4292969A GB 1270316 A GB1270316 A GB 1270316A
Authority
GB
United Kingdom
Prior art keywords
conductors
envelope
recesses
wafer
aug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB42929/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1270316A publication Critical patent/GB1270316A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00Hall-effect devices
    • H10N52/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N59/00Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/932Plan-view shape, i.e. in top view
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
GB42929/69A 1968-08-31 1969-08-28 Integrated semiconductor devices Expired GB1270316A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6812451A NL6812451A (https=) 1968-08-31 1968-08-31

Publications (1)

Publication Number Publication Date
GB1270316A true GB1270316A (en) 1972-04-12

Family

ID=19804517

Family Applications (1)

Application Number Title Priority Date Filing Date
GB42929/69A Expired GB1270316A (en) 1968-08-31 1969-08-28 Integrated semiconductor devices

Country Status (12)

Country Link
US (1) US3667000A (https=)
AT (1) AT308199B (https=)
BE (1) BE738220A (https=)
CH (1) CH502703A (https=)
DE (1) DE1942810C3 (https=)
DK (1) DK124365B (https=)
ES (1) ES370984A1 (https=)
FR (1) FR2017194A1 (https=)
GB (1) GB1270316A (https=)
NL (1) NL6812451A (https=)
NO (1) NO125420B (https=)
SE (1) SE341226B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3800193A (en) * 1972-09-05 1974-03-26 Ibm Magnetic sensing device
JPS529515B2 (https=) * 1972-11-08 1977-03-16
US3845445A (en) * 1973-11-12 1974-10-29 Ibm Modular hall effect device
DE3172553D1 (en) * 1980-11-28 1985-11-07 Toshiba Kk Method for manufacturing a module for a fiber optic link
DE3243039A1 (de) * 1982-11-22 1984-05-24 Telefunken electronic GmbH, 6000 Frankfurt Magnetempfindliches halbleiterbauelement
US5017804A (en) * 1987-07-23 1991-05-21 Siliconix Incorporated Hall sensing of bond wire current
DE4305439C2 (de) * 1993-02-23 1999-10-21 Eldo Elektronik Service Gmbh Umkapselung für einen elektronischen Sensor zur Feldstärkemessung
US5587857A (en) * 1994-10-18 1996-12-24 International Business Machines Corporation Silicon chip with an integrated magnetoresistive head mounted on a slider
US5883567A (en) * 1997-10-10 1999-03-16 Analog Devices, Inc. Packaged integrated circuit with magnetic flux concentrator
CN109387681B (zh) * 2018-12-28 2024-08-13 杭州思泰微电子有限公司 基于磁场检测的双通道电流传感器结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2877394A (en) * 1959-03-10 Hall effect device
GB1118284A (https=) *
US3050698A (en) * 1960-02-12 1962-08-21 Bell Telephone Labor Inc Semiconductor hall effect devices
CH385681A (de) * 1960-09-29 1964-12-15 Siemens Ag Einrichtung zur Übermittlung von Steuerbefehlen, insbesondere für Förderanlagen oder dergleichen
US3239786A (en) * 1963-05-09 1966-03-08 Gen Precision Inc Hall generator and method of fabrication
US3413713A (en) * 1965-06-18 1968-12-03 Motorola Inc Plastic encapsulated transistor and method of making same

Also Published As

Publication number Publication date
DE1942810C3 (de) 1978-06-01
CH502703A (de) 1971-01-31
US3667000A (en) 1972-05-30
DK124365B (da) 1972-10-09
SE341226B (https=) 1971-12-20
FR2017194A1 (https=) 1970-05-22
DE1942810A1 (de) 1970-03-05
NL6812451A (https=) 1970-03-03
NO125420B (https=) 1972-09-04
ES370984A1 (es) 1971-08-01
DE1942810B2 (de) 1977-10-06
AT308199B (de) 1973-06-25
BE738220A (https=) 1970-03-02

Similar Documents

Publication Publication Date Title
IL35503A0 (en) An electrical socket and an insulating carrier for an integrated circuit module
GB1252055A (https=)
GB1270316A (en) Integrated semiconductor devices
CA948329A (en) Integrated circuit arrangement using preformed semiconductor wafer
GB1237987A (https=)
GB1300881A (en) Improvements in or relating to stacked arrangements of semiconductor bodies
GB1305156A (https=)
CA921617A (en) Semiconductor integrated circuit device
CA994003A (en) Semiconductor integrated circuit arrangement
GB1477432A (en) Integrated crosspoint system
CA804796A (en) Encapsulated electronic semiconductor device
CA928863A (en) Semiconductor integrated circuit device
GB1272021A (en) Lead frame for the assembly of semiconductor devices
IL31526A (en) Semiconductor integrated circuit
AU428426B2 (en) Improved resin encapsulated semiconductor device
AU436201B2 (en) Integrated semiconductor circuit arrangement
CA840645A (en) Epoxy encapsulated semiconductor device
CA836794A (en) Epoxy encapsulated semiconductor device
CA832680A (en) Semiconductor devices with more than one semiconductor circuit element in one body
GB976441A (en) Diodes
AU433373B2 (en) Integrated semiconductor circuit
AU408437B2 (en) Integrated semiconductor circuit
AU411386B2 (en) A semiconductor resonance circuit device
AU4888169A (en) Improved resin encapsulated semiconductor device
AU5398269A (en) Integrated semiconductor circuit arrangement