GB1265489A - - Google Patents
Info
- Publication number
- GB1265489A GB1265489A GB1265489DA GB1265489A GB 1265489 A GB1265489 A GB 1265489A GB 1265489D A GB1265489D A GB 1265489DA GB 1265489 A GB1265489 A GB 1265489A
- Authority
- GB
- United Kingdom
- Prior art keywords
- styrene
- vinyl acetate
- methacrylic acid
- butadiene
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 10
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract 5
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 abstract 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- -1 polypropylene Polymers 0.000 abstract 3
- NBNGHXWJFSMASY-UHFFFAOYSA-N 2,3,4-tris(dimethylamino)phenol Chemical compound CN(C)C1=CC=C(O)C(N(C)C)=C1N(C)C NBNGHXWJFSMASY-UHFFFAOYSA-N 0.000 abstract 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000005977 Ethylene Substances 0.000 abstract 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000002775 capsule Substances 0.000 abstract 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 abstract 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005062 Polybutadiene Substances 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 abstract 1
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229920006322 acrylamide copolymer Polymers 0.000 abstract 1
- 229920006222 acrylic ester polymer Polymers 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 229910001234 light alloy Inorganic materials 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 abstract 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 abstract 1
- 229920002857 polybutadiene Polymers 0.000 abstract 1
- 229920006254 polymer film Polymers 0.000 abstract 1
- 229920001155 polypropylene Polymers 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 229920002689 polyvinyl acetate Polymers 0.000 abstract 1
- 239000011118 polyvinyl acetate Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3397368 | 1968-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1265489A true GB1265489A (enrdf_load_stackoverflow) | 1972-03-01 |
Family
ID=10359760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1265489D Expired GB1265489A (enrdf_load_stackoverflow) | 1968-07-17 | 1968-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1265489A (enrdf_load_stackoverflow) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063475A1 (en) * | 1981-04-21 | 1982-10-27 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| US4536524A (en) * | 1981-04-21 | 1985-08-20 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| GB2155938A (en) * | 1984-03-20 | 1985-10-02 | Westinghouse Electric Corp | Aqueous epoxy resin impregnatng composition |
| EP0209080A1 (en) * | 1985-07-10 | 1987-01-21 | The Oakland Corporation | Packaged adhesive |
| US4764579A (en) * | 1985-07-10 | 1988-08-16 | The Oakland Corporation | Packaged adhesive |
| GB2201681A (en) * | 1987-03-06 | 1988-09-07 | Swift Adhesives Ltd | Heat and pressure activated adhesive compositions |
| GB2224739A (en) * | 1988-08-30 | 1990-05-16 | Japan Synthetic Rubber Co Ltd | Modified epoxy compositions |
| EP0672707A3 (en) * | 1994-03-15 | 1996-07-03 | Toray Industries | Encapsulated curing agent for thermosetting resin compositions. |
| WO2004024841A3 (en) * | 2002-09-11 | 2004-07-15 | Henkel Loctite Deutschland Gmb | An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener |
| WO2005104744A3 (en) * | 2004-04-28 | 2006-02-02 | L & L Products Inc | Method for forming structures using an encapsulated adhesive material |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| EP2792724A1 (en) * | 2013-04-15 | 2014-10-22 | Samsung Display Co., Ltd. | Adhesive, adhesive tape and pre-product of an organic light emitting display device comprising an adhesive layer formed by the adhesive |
| CN105646797A (zh) * | 2016-04-01 | 2016-06-08 | 烟台德邦科技有限公司 | 一种丙烯酸酯改性环氧增韧剂的合成 |
-
1968
- 1968-07-17 GB GB1265489D patent/GB1265489A/en not_active Expired
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063475A1 (en) * | 1981-04-21 | 1982-10-27 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| US4536524A (en) * | 1981-04-21 | 1985-08-20 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| GB2155938A (en) * | 1984-03-20 | 1985-10-02 | Westinghouse Electric Corp | Aqueous epoxy resin impregnatng composition |
| EP0209080A1 (en) * | 1985-07-10 | 1987-01-21 | The Oakland Corporation | Packaged adhesive |
| US4764579A (en) * | 1985-07-10 | 1988-08-16 | The Oakland Corporation | Packaged adhesive |
| GB2201681A (en) * | 1987-03-06 | 1988-09-07 | Swift Adhesives Ltd | Heat and pressure activated adhesive compositions |
| GB2224739A (en) * | 1988-08-30 | 1990-05-16 | Japan Synthetic Rubber Co Ltd | Modified epoxy compositions |
| GB2224739B (en) * | 1988-08-30 | 1992-09-23 | Japan Synthetic Rubber Co Ltd | Modified epoxy composition |
| EP0672707A3 (en) * | 1994-03-15 | 1996-07-03 | Toray Industries | Encapsulated curing agent for thermosetting resin compositions. |
| WO2004024841A3 (en) * | 2002-09-11 | 2004-07-15 | Henkel Loctite Deutschland Gmb | An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener |
| WO2005104744A3 (en) * | 2004-04-28 | 2006-02-02 | L & L Products Inc | Method for forming structures using an encapsulated adhesive material |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| US9688050B2 (en) | 2004-06-18 | 2017-06-27 | Zephyros, Inc. | Panel structure |
| US10647083B2 (en) | 2004-06-18 | 2020-05-12 | Zephyros, Inc. | Panel structure |
| EP2792724A1 (en) * | 2013-04-15 | 2014-10-22 | Samsung Display Co., Ltd. | Adhesive, adhesive tape and pre-product of an organic light emitting display device comprising an adhesive layer formed by the adhesive |
| CN105646797A (zh) * | 2016-04-01 | 2016-06-08 | 烟台德邦科技有限公司 | 一种丙烯酸酯改性环氧增韧剂的合成 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |