GB1258942A - - Google Patents

Info

Publication number
GB1258942A
GB1258942A GB1258942DA GB1258942A GB 1258942 A GB1258942 A GB 1258942A GB 1258942D A GB1258942D A GB 1258942DA GB 1258942 A GB1258942 A GB 1258942A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
metal
leads
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL6802060A external-priority patent/NL6802060A/xx
Priority claimed from NL6802061A external-priority patent/NL6802061A/xx
Application filed filed Critical
Publication of GB1258942A publication Critical patent/GB1258942A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Die Bonding (AREA)
GB1258942D 1968-02-13 1969-02-10 Expired GB1258942A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL6802060A NL6802060A (enExample) 1968-02-13 1968-02-13
NL6802061A NL6802061A (enExample) 1968-02-13 1968-02-13

Publications (1)

Publication Number Publication Date
GB1258942A true GB1258942A (enExample) 1971-12-30

Family

ID=26644295

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1251757D Expired GB1251757A (enExample) 1968-02-13 1969-02-10
GB1258942D Expired GB1258942A (enExample) 1968-02-13 1969-02-10

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1251757D Expired GB1251757A (enExample) 1968-02-13 1969-02-10

Country Status (5)

Country Link
BE (2) BE728375A (enExample)
CH (2) CH496815A (enExample)
DE (2) DE1906726A1 (enExample)
FR (2) FR2001820A1 (enExample)
GB (2) GB1251757A (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482329A (en) * 1946-05-27 1949-09-20 Rca Corp Apparatus for selective vapor coating
US3007028A (en) * 1955-06-28 1961-10-31 Nat Presto Ind Electrically heated device with plug-in thermostat
GB839081A (en) * 1957-12-13 1960-06-29 Westinghouse Electric Corp Improvements in or relating to evaporation processes for the deposition of metals, particularly for use in the making of semi-conductor devices
FR1497294A (fr) * 1965-10-22 1967-10-06 Motorola Inc Procédé pour la métallisation des semi-conducteurs et semi-conducteurs formes par ce procédé
FR1536321A (fr) * 1966-06-30 1968-08-10 Texas Instruments Inc Contacts ohmiques pour des dispositifs à semi-conducteurs

Also Published As

Publication number Publication date
CH496815A (de) 1970-09-30
FR2001820A1 (fr) 1969-10-03
DE1906727A1 (de) 1969-09-25
GB1251757A (enExample) 1971-10-27
BE728374A (enExample) 1969-08-13
FR2001819A1 (fr) 1969-10-03
DE1906726A1 (de) 1969-09-18
BE728375A (enExample) 1969-08-13
CH491499A (de) 1970-05-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees