GB1258660A - - Google Patents

Info

Publication number
GB1258660A
GB1258660A GB6196369A GB1258660DA GB1258660A GB 1258660 A GB1258660 A GB 1258660A GB 6196369 A GB6196369 A GB 6196369A GB 1258660D A GB1258660D A GB 1258660DA GB 1258660 A GB1258660 A GB 1258660A
Authority
GB
United Kingdom
Prior art keywords
paper
circuit
layer
carrier layer
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6196369A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1258660A publication Critical patent/GB1258660A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB6196369A 1969-12-19 1969-12-19 Expired GB1258660A (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB6196369 1969-12-19
DE19691965493 DE1965493B2 (de) 1969-12-19 1969-12-30 Schichtmaterial

Publications (1)

Publication Number Publication Date
GB1258660A true GB1258660A (https=) 1971-12-30

Family

ID=25758302

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6196369A Expired GB1258660A (https=) 1969-12-19 1969-12-19

Country Status (2)

Country Link
DE (1) DE1965493B2 (https=)
GB (1) GB1258660A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329779A (en) 1979-02-26 1982-05-18 National Research Development Corporation Methods of applying circuit elements to a substrate
WO1983000408A1 (fr) * 1981-07-16 1983-02-03 Joachim Sieg Composant opto-electronique
WO1987004010A1 (en) * 1985-12-20 1987-07-02 Hughes Aircraft Company Chip interface mesa
US4697885A (en) * 1982-12-01 1987-10-06 Asahi Glass Company, Ltd. Display device and decal for forming a display panel terminal
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
GB2290664A (en) * 1994-06-14 1996-01-03 Murata Manufacturing Co Manufacturing a multilayer ceramic electrical component
US5916401A (en) * 1994-04-05 1999-06-29 The University Of Queensland Coating of substrates
EP1093327A3 (en) * 1999-10-15 2003-12-10 E.I. Dupont De Nemours And Company An improved method to embed passive components
CN116113166A (zh) * 2023-01-04 2023-05-12 江西鼎华芯泰科技有限公司 一种电路板的制作方法和电子标签的制作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292548A (en) * 1990-04-03 1994-03-08 Vistatech Corporation Substrates used in multilayered integrated circuits and multichips

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329779A (en) 1979-02-26 1982-05-18 National Research Development Corporation Methods of applying circuit elements to a substrate
WO1983000408A1 (fr) * 1981-07-16 1983-02-03 Joachim Sieg Composant opto-electronique
US4697885A (en) * 1982-12-01 1987-10-06 Asahi Glass Company, Ltd. Display device and decal for forming a display panel terminal
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
WO1987004010A1 (en) * 1985-12-20 1987-07-02 Hughes Aircraft Company Chip interface mesa
US5916401A (en) * 1994-04-05 1999-06-29 The University Of Queensland Coating of substrates
GB2290664A (en) * 1994-06-14 1996-01-03 Murata Manufacturing Co Manufacturing a multilayer ceramic electrical component
US5700338A (en) * 1994-06-14 1997-12-23 Murata Manufacturing Co., Ltd. Method of manufacturing resistor integrated in sintered body and method of manufacturing multilayer ceramic electronic component
GB2290664B (en) * 1994-06-14 1998-03-04 Murata Manufacturing Co Method of manufacturing resistor integrated in sintered body and method of manufacturing multilayer ceramic electronic component
EP1093327A3 (en) * 1999-10-15 2003-12-10 E.I. Dupont De Nemours And Company An improved method to embed passive components
CN116113166A (zh) * 2023-01-04 2023-05-12 江西鼎华芯泰科技有限公司 一种电路板的制作方法和电子标签的制作方法

Also Published As

Publication number Publication date
DE1965493B2 (de) 1972-02-17
DE1965493A1 (de) 1971-07-15

Similar Documents

Publication Publication Date Title
EP1093327B1 (en) An improved method to embed passive components
GB1258660A (https=)
US3950200A (en) Method of fabricating thermal printing head
US3729819A (en) Method and device for fabricating printed wiring or the like
EP1126973A1 (en) Electrically conductive adhesive transfers
GB1463317A (en) Electrical resistance heating elements
US3158503A (en) Metallizing holes
US3981761A (en) Process for manufacturing printed substrates and decalcomania compositions used therefor
JP5569733B2 (ja) 導電性銀ペースト、導電性パターンの形成方法及び導電性パターン印刷物
JP2001028476A (ja) 歪みのない回路を形成する方法
GB1320625A (en) Method of adjusting the resistivity of thick-film screen printed resistors
EP0242020A3 (en) Electrical circuits
JPH035075B2 (https=)
KR20150088186A (ko) 전극의 제조방법 및 박리형 전자재료용 전극 페이스트 조성물
GB1241121A (en) Improvements relating to the manufacture of thick film circuit elements
JPS55111152A (en) Method of manufacturing multilayer thin film circuit board
GB959425A (en) Improvements in or relating to printed circuits for electronic and other electrical equipment
GB1445171A (en) Method of making printed circuits
JPS60140788A (ja) パツド印刷による回路形成方法
JPS5877287A (ja) 印刷配線板の製造方法
SWARTZ Thick-film networks(Packaging techniques for miniaturized thick film networks)[Final Report]
JPH07101565B2 (ja) 内層用銅ペ−スト組成物
GB1468919A (en) Resistors or conductors printed on ceramic substrates
JPH0497590A (ja) 多層セラミック回路基板及びその製造方法
JPH05145236A (ja) セラミツク多層配線基板の製造方法

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee