GB1241121A - Improvements relating to the manufacture of thick film circuit elements - Google Patents

Improvements relating to the manufacture of thick film circuit elements

Info

Publication number
GB1241121A
GB1241121A GB1073169A GB1073169A GB1241121A GB 1241121 A GB1241121 A GB 1241121A GB 1073169 A GB1073169 A GB 1073169A GB 1073169 A GB1073169 A GB 1073169A GB 1241121 A GB1241121 A GB 1241121A
Authority
GB
United Kingdom
Prior art keywords
substrate
photo
resist material
resist
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1073169A
Inventor
Ronald Naylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB1073169A priority Critical patent/GB1241121A/en
Publication of GB1241121A publication Critical patent/GB1241121A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

1,241,121. Resistance elements; printed circuits. FERRANTI Ltd. 27 Feb., 1970 [28 Feb., 1969], No. 10731/69. Headings H1R and H1S. A process of manufacturing a thick film circuit element comprises applying an adherent layer of photo-resist material 12 to a plane surface 11 of a laminar ceramic substrate, forming apertures 13 in the photo resist layer corresponding to the required element profile by known methods (e.g. photolithography), applying a paste 14 of the thick film material on to the substrate through the apertures and in the required sequence removing the photo resist mask, hardening the paste and bonding the element to the substrate. The element paste which may be applied manually 15 or screen printed on to the substrate includes a binder such as a glaze in its composition. The resist material may be removed by stripping or by a solvent. Where the element is bonded to the substrate by the glaze the resist material may be removed when the element is fired at a high temperature. The sheet of photo resist material (e.g. " Riston " (Registered Trade Mark)) has a minimum thickness of 0À001 inch. By increasing the thickness of the resist or using multiple layers circuit elements of different thicknesses can be made. An initially-liquid photo-resist material may be used to obtain the required thickness.
GB1073169A 1969-02-28 1969-02-28 Improvements relating to the manufacture of thick film circuit elements Expired GB1241121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1073169A GB1241121A (en) 1969-02-28 1969-02-28 Improvements relating to the manufacture of thick film circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1073169A GB1241121A (en) 1969-02-28 1969-02-28 Improvements relating to the manufacture of thick film circuit elements

Publications (1)

Publication Number Publication Date
GB1241121A true GB1241121A (en) 1971-07-28

Family

ID=9973247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1073169A Expired GB1241121A (en) 1969-02-28 1969-02-28 Improvements relating to the manufacture of thick film circuit elements

Country Status (1)

Country Link
GB (1) GB1241121A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747911A1 (en) * 1995-06-06 1996-12-11 E.I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor
US5624782A (en) * 1994-04-14 1997-04-29 E. I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor elements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5624782A (en) * 1994-04-14 1997-04-29 E. I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor elements
EP0747911A1 (en) * 1995-06-06 1996-12-11 E.I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor

Similar Documents

Publication Publication Date Title
DK0664016T3 (en) Method for making and using a screen-edged template with raised edges
US3729819A (en) Method and device for fabricating printed wiring or the like
DE1615705A1 (en) Thin layer circuits and methods of making them
US2965952A (en) Method for manufacturing etched circuitry
US3981761A (en) Process for manufacturing printed substrates and decalcomania compositions used therefor
GB1241121A (en) Improvements relating to the manufacture of thick film circuit elements
US3538847A (en) Method of making a screen stencil
GB1284109A (en) Method of making thin film circuits
JP2867464B2 (en) Printing plate
JPS62246887A (en) Manufacture of photographic ceramic plate
JPS6187393A (en) Optical thick film hybrid method
JPS55158999A (en) Screen printing plate and manufacturing of the same
JP3058905B2 (en) Method for producing transfer paper for ceramics and ceramic products
JPH11245497A (en) Method for forming pattern and patterned substrate
JPS5836449A (en) Manufacture of vinyl-chloride steel plate
JPH0497591A (en) Method of forming pattern of multilayer inter connection board
JPS57170763A (en) Preparation of multinozzle head
JPS588600B2 (en) Ryomen Print High Senban no Seizouhouhou
JPS6348891A (en) Manufacture of printed wiring board
JPS60207336A (en) Exposure for photoetching
JPS63116846A (en) Method of forming pattern
FR2045025A5 (en) Thick-film circuits on flat substrates
JPS55111152A (en) Method of manufacturing multilayer thin film circuit board
JPH08204313A (en) Fine-pattern printed circuit
JPS62232990A (en) Conductor circuit and manufacture of the same