GB1258514A - - Google Patents

Info

Publication number
GB1258514A
GB1258514A GB1258514DA GB1258514A GB 1258514 A GB1258514 A GB 1258514A GB 1258514D A GB1258514D A GB 1258514DA GB 1258514 A GB1258514 A GB 1258514A
Authority
GB
United Kingdom
Prior art keywords
finishing
ring
receiver
workpieces
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1258514A publication Critical patent/GB1258514A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GB1258514D 1968-03-22 1969-02-20 Expired GB1258514A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71535068A 1968-03-22 1968-03-22

Publications (1)

Publication Number Publication Date
GB1258514A true GB1258514A (https=) 1971-12-30

Family

ID=24873677

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1258514D Expired GB1258514A (https=) 1968-03-22 1969-02-20

Country Status (4)

Country Link
US (1) US3550325A (https=)
DE (1) DE1914082C3 (https=)
FR (1) FR1600784A (https=)
GB (1) GB1258514A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354A (en) * 1983-07-15 1985-03-06 Helical Springs Limited Grinding apparatus

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
DE19756536A1 (de) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Verfahren zum Polieren von scheibenförmigen Werkstücken und Vorrichtung zur Durchführung des Verfahrens
DE10004578C1 (de) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante
RU2175283C1 (ru) * 2000-06-22 2001-10-27 Воронежская государственная технологическая академия Устройство для шлифовки полупроводниковых пластин
RU2191674C1 (ru) * 2001-08-06 2002-10-27 Государственное образовательное учреждение Воронежская государственная технологическая академия Устройство для шлифования полупроводниковых пластин
US20040157539A1 (en) * 2002-07-26 2004-08-12 Stenftenagel John R. Scuffing machine for finishing wood products
CN111515838A (zh) * 2019-07-23 2020-08-11 杭州友邻电子有限公司 一种高效率的智能锁外壳加工设备
CN110918338A (zh) * 2019-10-17 2020-03-27 福清市海威钓具有限公司 一种环保型鱼竿喷漆装置及喷漆工艺
CN112123197B (zh) * 2020-09-24 2024-03-22 郑州方铭高温陶瓷新材料有限公司 一种双轨道滑板砖平面研磨机
CN113997176B (zh) * 2021-10-21 2023-02-28 西安银马实业发展有限公司 磨头自浮动石材磨削抛光机

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354A (en) * 1983-07-15 1985-03-06 Helical Springs Limited Grinding apparatus

Also Published As

Publication number Publication date
DE1914082A1 (de) 1969-10-02
DE1914082C3 (de) 1980-03-13
FR1600784A (https=) 1970-07-27
DE1914082B2 (de) 1979-07-05
US3550325A (en) 1970-12-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee