GB1244101A - Metallising a substrate - Google Patents

Metallising a substrate

Info

Publication number
GB1244101A
GB1244101A GB388269A GB388269A GB1244101A GB 1244101 A GB1244101 A GB 1244101A GB 388269 A GB388269 A GB 388269A GB 388269 A GB388269 A GB 388269A GB 1244101 A GB1244101 A GB 1244101A
Authority
GB
United Kingdom
Prior art keywords
substrate
noble metal
coated
cui
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB388269A
Inventor
Melvin David Sterman
David Joseph Genova
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of GB1244101A publication Critical patent/GB1244101A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/06—Thin magnetic films, e.g. of one-domain structure characterised by the coupling or physical contact with connecting or interacting conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)

Abstract

1,244,101. Magnetic structures. EASTMAN KODAK CO. 23 Jan., 1969 [25 Jan., 1968], No. 3882/69. Heading H1H. [Also in Division C7] A substrate is coated with a ferromagnetic layer as follows: the substrate is coated with a noble metal layer, the noble metal being formed by reduction of a noble metal salt by Cul, and the so-coated substrate is contacted with a solution of a compound of a ferromagnetic element and a reducing agent therefor at a temperature whereat the noble metal catalyses the action of said reducing agent. The substrate may be polyethylene terephthalate, cellulose triacetate, other plastics, or paper, and may be coated with an adhesive polymer layer. The noble metal is Pt, Pd, or Au, and is applied either by reacting CuI and a salt thereof in solution in the presence of a binder and the substrate, or by applying CuI/binder to the substrate and immersing the CuI-coated substrate in noble metal salt solution. The ferromagnetic element is Fe, Co, or Ni, and is coated on to the noble metal layer from a conventional electroless hypophosphite bath.
GB388269A 1968-01-25 1969-01-23 Metallising a substrate Expired GB1244101A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70037368A 1968-01-25 1968-01-25

Publications (1)

Publication Number Publication Date
GB1244101A true GB1244101A (en) 1971-08-25

Family

ID=24813246

Family Applications (1)

Application Number Title Priority Date Filing Date
GB388269A Expired GB1244101A (en) 1968-01-25 1969-01-23 Metallising a substrate

Country Status (3)

Country Link
US (1) US3520723A (en)
FR (1) FR2000726A1 (en)
GB (1) GB1244101A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2402402A (en) * 2003-06-02 2004-12-08 Samsung Sdi Co Ltd Substrate for immobilizing physiological material

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2409251C3 (en) * 1974-02-22 1979-03-15 Kollmorgen Corp., Hartford, Conn. (V.St.A.) Process for the catalytic seeding of non-metallic surfaces for a subsequent, electroless metallization and bath solutions for carrying out the process
DE2635457C2 (en) * 1976-08-04 1985-06-05 Schering AG, 1000 Berlin und 4709 Bergkamen Catalytic varnish and its use in the manufacture of printed circuits
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US5411795A (en) * 1992-10-14 1995-05-02 Monsanto Company Electroless deposition of metal employing thermally stable carrier polymers
CN1968746B (en) * 2004-06-10 2011-07-27 住友电气工业株式会社 Metal catalyst and method for preparation thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1250517B (en) * 1967-09-21 Siemens Aktiengesellschaft, Berlin und München, Erlangen Transparent conductive layer
US3347724A (en) * 1964-08-19 1967-10-17 Photocircuits Corp Metallizing flexible substrata

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2402402A (en) * 2003-06-02 2004-12-08 Samsung Sdi Co Ltd Substrate for immobilizing physiological material
GB2402402B (en) * 2003-06-02 2008-01-09 Samsung Sdi Co Ltd Substrate for immobilizing physiological material, and a method of preparing the same

Also Published As

Publication number Publication date
FR2000726A1 (en) 1969-09-12
US3520723A (en) 1970-07-14

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