GB1242995A - Electroless nickel plating on a nonconductive substrate - Google Patents
Electroless nickel plating on a nonconductive substrateInfo
- Publication number
- GB1242995A GB1242995A GB450670A GB450670A GB1242995A GB 1242995 A GB1242995 A GB 1242995A GB 450670 A GB450670 A GB 450670A GB 450670 A GB450670 A GB 450670A GB 1242995 A GB1242995 A GB 1242995A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating
- substrate
- electroless
- naoh
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 11
- 238000007747 plating Methods 0.000 title abstract 6
- 239000000758 substrate Substances 0.000 title abstract 6
- 229910052759 nickel Inorganic materials 0.000 title abstract 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 9
- 230000004913 activation Effects 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 1
- 229910017855 NH 4 F Inorganic materials 0.000 abstract 1
- 241000080590 Niso Species 0.000 abstract 1
- 206010070834 Sensitisation Diseases 0.000 abstract 1
- 230000003213 activating effect Effects 0.000 abstract 1
- 238000001994 activation Methods 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 239000003599 detergent Substances 0.000 abstract 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 239000003002 pH adjusting agent Substances 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000000123 paper Substances 0.000 abstract 1
- 150000002978 peroxides Chemical class 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 230000008313 sensitization Effects 0.000 abstract 1
- 230000001235 sensitizing effect Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000002023 wood Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US80059769A | 1969-02-19 | 1969-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1242995A true GB1242995A (en) | 1971-08-18 |
Family
ID=25178825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB450670A Expired GB1242995A (en) | 1969-02-19 | 1970-01-30 | Electroless nickel plating on a nonconductive substrate |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3639143A (https=) |
| JP (1) | JPS4829017B1 (https=) |
| FR (1) | FR2033864A5 (https=) |
| GB (1) | GB1242995A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2160897A (en) * | 1984-05-24 | 1986-01-02 | Aisin Seiki | Electroless plating solution |
| RU2350687C1 (ru) * | 2007-05-22 | 2009-03-27 | Государственное образовательное учреждение высшего профессионального образования Ивановский государственный химико-технологический университет | Способ химической металлизации поверхности деталей (варианты) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3669770A (en) * | 1971-02-08 | 1972-06-13 | Rca Corp | Method of making abrasion-resistant metal-coated glass photomasks |
| US3916056A (en) * | 1972-12-29 | 1975-10-28 | Rca Corp | Photomask bearing a pattern of metal plated areas |
| US4154869A (en) * | 1977-12-30 | 1979-05-15 | Honeywell Inc. | Electroless plating method with inspection for an unbroken layer of water prior to plating |
| JPS5950443A (ja) * | 1982-09-16 | 1984-03-23 | Hitachi Ltd | Ｘ線マスク |
| US4473602A (en) * | 1982-12-30 | 1984-09-25 | International Business Machines Corporation | Palladium activation of 2.5% silicon iron prior to electroless nickel plating |
| US6406750B1 (en) | 1999-05-28 | 2002-06-18 | Osaka Municipal Government | Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film |
| SG112925A1 (en) * | 2003-12-18 | 2005-07-28 | Fuji Elec Device Tech Co Ltd | Method of pretreating a nonmagnetic substrate and a magnetic recording medium |
| US20080241401A1 (en) * | 2007-03-28 | 2008-10-02 | Hok-Kin Choi | Method of monitoring electroless plating chemistry |
| KR101763989B1 (ko) * | 2011-01-11 | 2017-08-02 | 맥더미드 앤손 아메리카 엘엘씨 | 무전해 도금조 조성물 및 입자상 물질 도금 방법 |
| US10787743B2 (en) * | 2017-08-28 | 2020-09-29 | The Boeing Company | Depositing a structurally hard, wear resistant metal coating onto a substrate |
| CN110129777A (zh) * | 2019-06-10 | 2019-08-16 | 德华兔宝宝装饰新材股份有限公司 | 一种表面化学镀Ni-W-P三元合金层的防腐蚀木材的短流程制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075856A (en) * | 1958-03-31 | 1963-01-29 | Gen Electric | Copper plating process and solution |
| US3212918A (en) * | 1962-05-28 | 1965-10-19 | Ibm | Electroless plating process |
-
1969
- 1969-02-19 US US3639143D patent/US3639143A/en not_active Expired - Lifetime
-
1970
- 1970-01-30 GB GB450670A patent/GB1242995A/en not_active Expired
- 1970-02-03 FR FR7003618A patent/FR2033864A5/fr not_active Expired
- 1970-02-10 JP JP1120470A patent/JPS4829017B1/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2160897A (en) * | 1984-05-24 | 1986-01-02 | Aisin Seiki | Electroless plating solution |
| RU2350687C1 (ru) * | 2007-05-22 | 2009-03-27 | Государственное образовательное учреждение высшего профессионального образования Ивановский государственный химико-технологический университет | Способ химической металлизации поверхности деталей (варианты) |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4829017B1 (https=) | 1973-09-06 |
| US3639143A (en) | 1972-02-01 |
| FR2033864A5 (https=) | 1970-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |