JPS4829017B1 - - Google Patents
Info
- Publication number
- JPS4829017B1 JPS4829017B1 JP1120470A JP1120470A JPS4829017B1 JP S4829017 B1 JPS4829017 B1 JP S4829017B1 JP 1120470 A JP1120470 A JP 1120470A JP 1120470 A JP1120470 A JP 1120470A JP S4829017 B1 JPS4829017 B1 JP S4829017B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80059769A | 1969-02-19 | 1969-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4829017B1 true JPS4829017B1 (ja) | 1973-09-06 |
Family
ID=25178825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1120470A Pending JPS4829017B1 (ja) | 1969-02-19 | 1970-02-10 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3639143A (ja) |
JP (1) | JPS4829017B1 (ja) |
FR (1) | FR2033864A5 (ja) |
GB (1) | GB1242995A (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3669770A (en) * | 1971-02-08 | 1972-06-13 | Rca Corp | Method of making abrasion-resistant metal-coated glass photomasks |
US3916056A (en) * | 1972-12-29 | 1975-10-28 | Rca Corp | Photomask bearing a pattern of metal plated areas |
US4154869A (en) * | 1977-12-30 | 1979-05-15 | Honeywell Inc. | Electroless plating method with inspection for an unbroken layer of water prior to plating |
JPS5950443A (ja) * | 1982-09-16 | 1984-03-23 | Hitachi Ltd | X線マスク |
US4473602A (en) * | 1982-12-30 | 1984-09-25 | International Business Machines Corporation | Palladium activation of 2.5% silicon iron prior to electroless nickel plating |
JPS60248882A (ja) * | 1984-05-24 | 1985-12-09 | Aisin Seiki Co Ltd | 高リン含有ニツケル合金の無電解めつき浴 |
US6406750B1 (en) | 1999-05-28 | 2002-06-18 | Osaka Municipal Government | Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film |
SG112925A1 (en) * | 2003-12-18 | 2005-07-28 | Fuji Elec Device Tech Co Ltd | Method of pretreating a nonmagnetic substrate and a magnetic recording medium |
US20080241401A1 (en) * | 2007-03-28 | 2008-10-02 | Hok-Kin Choi | Method of monitoring electroless plating chemistry |
WO2012097037A2 (en) | 2011-01-11 | 2012-07-19 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
US10787743B2 (en) * | 2017-08-28 | 2020-09-29 | The Boeing Company | Depositing a structurally hard, wear resistant metal coating onto a substrate |
CN110129777A (zh) * | 2019-06-10 | 2019-08-16 | 德华兔宝宝装饰新材股份有限公司 | 一种表面化学镀Ni-W-P三元合金层的防腐蚀木材的短流程制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3075856A (en) * | 1958-03-31 | 1963-01-29 | Gen Electric | Copper plating process and solution |
US3212918A (en) * | 1962-05-28 | 1965-10-19 | Ibm | Electroless plating process |
-
1969
- 1969-02-19 US US3639143D patent/US3639143A/en not_active Expired - Lifetime
-
1970
- 1970-01-30 GB GB450670A patent/GB1242995A/en not_active Expired
- 1970-02-03 FR FR7003618A patent/FR2033864A5/fr not_active Expired
- 1970-02-10 JP JP1120470A patent/JPS4829017B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1242995A (en) | 1971-08-18 |
US3639143A (en) | 1972-02-01 |
FR2033864A5 (ja) | 1970-12-04 |