GB1210175A - Printed wiring panels - Google Patents

Printed wiring panels

Info

Publication number
GB1210175A
GB1210175A GB1815568A GB1815568A GB1210175A GB 1210175 A GB1210175 A GB 1210175A GB 1815568 A GB1815568 A GB 1815568A GB 1815568 A GB1815568 A GB 1815568A GB 1210175 A GB1210175 A GB 1210175A
Authority
GB
United Kingdom
Prior art keywords
epoxy resin
substrate
resin
layers
final
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1815568A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1210175A publication Critical patent/GB1210175A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

1,210,175. Laminates. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 17 April, 1968 [20 April, 1967], No. 18155/68. Heading B5N. [Also in Division H1] A printed circuit having the conductive elements 31, Fig. 5, impressed into the surface of the supporting substrate 41, is made by initially heating and compressing an assembly consisting of a dielectric substrate of epoxy resin, e.g. a resin based on bisulphenol A or a novolak type resin, reinforced with at least two layers of glass, sandwiched between two metal foils, e.g. of copper, aluminium or nickel, coated with adhesive on their inner surfaces. The adhesive may be a mixture of a phenol- or cresol-formaldehyde resol resin with an acrylonitrile butadiene copolymer or an epoxy resin mixed with an elastomer. The desired wiring pattern is then formed in the metal layers by etching or photoetching. Subsequently the assembly is split between the two layers of glass and the individual sheets applied to one or both sides of an insulating supporting base 51, e.g. of wholly or partly cured epoxy resin which may be reinforced with a mat or tissue form of glass fibre, by heat and pressure so that it is adhered to the base and the conductive elements are pressed into the surface of the substrate. The epoxy resin substrate is partly cured during the initial heating and compressing operation and completely cured in the final such operation. The final assembly may be non-planar, its shape having been formed by the final press or the supporting base may have been provided with a non-planar form initially.
GB1815568A 1967-04-20 1968-04-17 Printed wiring panels Expired GB1210175A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6705522A NL6705522A (en) 1967-04-20 1967-04-20

Publications (1)

Publication Number Publication Date
GB1210175A true GB1210175A (en) 1970-10-28

Family

ID=19799898

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1815568A Expired GB1210175A (en) 1967-04-20 1968-04-17 Printed wiring panels

Country Status (6)

Country Link
AT (1) AT281957B (en)
BE (1) BE713873A (en)
DE (1) DE1704881A1 (en)
FR (1) FR1567363A (en)
GB (1) GB1210175A (en)
NL (1) NL6705522A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7453145B2 (en) 2002-07-08 2008-11-18 Siemens Aktiengesellschaft Electronics unit

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2473834A1 (en) * 1980-01-11 1981-07-17 Thomson Csf Soldering micro-components onto printed circuits - using liq. heated to above solder m.pt. to heat substrate
DE3511300C2 (en) * 1985-03-28 1987-04-02 Daimler-Benz Ag, 7000 Stuttgart Electromagnetic coupling for creating a rotational connection
EP0312631A1 (en) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Method for manufacturing electrical connection between flat electrical conducting paths and circuit board manufactured with this method
JPH0325996A (en) * 1989-06-23 1991-02-04 Nitto Boseki Co Ltd Transfer sheet for injection molding printed circuit board and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7453145B2 (en) 2002-07-08 2008-11-18 Siemens Aktiengesellschaft Electronics unit

Also Published As

Publication number Publication date
BE713873A (en) 1968-10-18
FR1567363A (en) 1969-05-16
DE1704881A1 (en) 1971-05-27
NL6705522A (en) 1968-10-21
AT281957B (en) 1970-06-10

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees