AT281957B - Process for the production of a board with extensive wiring - Google Patents
Process for the production of a board with extensive wiringInfo
- Publication number
- AT281957B AT281957B AT372768A AT372768A AT281957B AT 281957 B AT281957 B AT 281957B AT 372768 A AT372768 A AT 372768A AT 372768 A AT372768 A AT 372768A AT 281957 B AT281957 B AT 281957B
- Authority
- AT
- Austria
- Prior art keywords
- board
- production
- extensive wiring
- extensive
- wiring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6705522A NL6705522A (en) | 1967-04-20 | 1967-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
AT281957B true AT281957B (en) | 1970-06-10 |
Family
ID=19799898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT372768A AT281957B (en) | 1967-04-20 | 1968-04-17 | Process for the production of a board with extensive wiring |
Country Status (6)
Country | Link |
---|---|
AT (1) | AT281957B (en) |
BE (1) | BE713873A (en) |
DE (1) | DE1704881A1 (en) |
FR (1) | FR1567363A (en) |
GB (1) | GB1210175A (en) |
NL (1) | NL6705522A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2473834A1 (en) * | 1980-01-11 | 1981-07-17 | Thomson Csf | Soldering micro-components onto printed circuits - using liq. heated to above solder m.pt. to heat substrate |
DE3511300A1 (en) * | 1985-03-28 | 1986-10-02 | Daimler-Benz Ag, 7000 Stuttgart | Electromagnetic clutch for producing a rotational connection |
EP0312631A1 (en) * | 1987-10-21 | 1989-04-26 | PRESSKONTAKT Ing. grad. Hartmuth Thaler KG | Method for manufacturing electrical connection between flat electrical conducting paths and circuit board manufactured with this method |
JPH0325996A (en) * | 1989-06-23 | 1991-02-04 | Nitto Boseki Co Ltd | Transfer sheet for injection molding printed circuit board and manufacture thereof |
DE10230712B4 (en) * | 2002-07-08 | 2006-03-23 | Siemens Ag | Electronic unit with a low-melting metallic carrier |
-
1967
- 1967-04-20 NL NL6705522A patent/NL6705522A/xx unknown
-
1968
- 1968-03-01 DE DE19681704881 patent/DE1704881A1/en active Pending
- 1968-04-17 GB GB1815568A patent/GB1210175A/en not_active Expired
- 1968-04-17 AT AT372768A patent/AT281957B/en not_active IP Right Cessation
- 1968-04-18 BE BE713873D patent/BE713873A/xx unknown
- 1968-04-19 FR FR1567363D patent/FR1567363A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1567363A (en) | 1969-05-16 |
GB1210175A (en) | 1970-10-28 |
NL6705522A (en) | 1968-10-21 |
BE713873A (en) | 1968-10-18 |
DE1704881A1 (en) | 1971-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |