GB1207265A - Improvements in or relating to circuit components - Google Patents
Improvements in or relating to circuit componentsInfo
- Publication number
- GB1207265A GB1207265A GB709668A GB709668A GB1207265A GB 1207265 A GB1207265 A GB 1207265A GB 709668 A GB709668 A GB 709668A GB 709668 A GB709668 A GB 709668A GB 1207265 A GB1207265 A GB 1207265A
- Authority
- GB
- United Kingdom
- Prior art keywords
- box
- semi
- plastics
- trough
- feb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004033 plastic Substances 0.000 abstract 3
- 229920003023 plastic Polymers 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- QBWKPGNFQQJGFY-QLFBSQMISA-N 3-[(1r)-1-[(2r,6s)-2,6-dimethylmorpholin-4-yl]ethyl]-n-[6-methyl-3-(1h-pyrazol-4-yl)imidazo[1,2-a]pyrazin-8-yl]-1,2-thiazol-5-amine Chemical compound N1([C@H](C)C2=NSC(NC=3C4=NC=C(N4C=C(C)N=3)C3=CNN=C3)=C2)C[C@H](C)O[C@H](C)C1 QBWKPGNFQQJGFY-QLFBSQMISA-N 0.000 abstract 1
- 239000006004 Quartz sand Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 229940125846 compound 25 Drugs 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH211967A CH452063A (de) | 1967-02-14 | 1967-02-14 | Baueinheit für eine Schaltungseinrichtung |
| CH114968A CH487574A (de) | 1967-02-14 | 1968-01-24 | Baueinheit für eine Schaltungseinrichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1207265A true GB1207265A (en) | 1970-09-30 |
Family
ID=25686808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB709668A Expired GB1207265A (en) | 1967-02-14 | 1968-02-13 | Improvements in or relating to circuit components |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH487574A (enrdf_load_stackoverflow) |
| DE (1) | DE1985661U (enrdf_load_stackoverflow) |
| FR (1) | FR1555077A (enrdf_load_stackoverflow) |
| GB (1) | GB1207265A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1601239A1 (de) * | 2004-05-25 | 2005-11-30 | ebm-papst Mulfingen GmbH & Co.KG | Kühlanordnung für ein elektrisches oder elektronisches Bauteil und Verfahren zu deren Montage |
| FR2914531A1 (fr) * | 2007-03-27 | 2008-10-03 | Valeo Electronique Sys Liaison | Boitier a circuit imprime etanche |
| WO2013064343A1 (en) * | 2011-11-03 | 2013-05-10 | Osram Gmbh | Driver assembly and method for manufacturing the same |
| CN112993438A (zh) * | 2021-02-08 | 2021-06-18 | 中电科创智联(武汉)有限责任公司 | 一种叉车锂电池半导体热管理系统 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2201612B1 (enrdf_load_stackoverflow) * | 1972-10-03 | 1976-10-29 | Cem Comp Electro Mec |
-
1968
- 1968-01-24 CH CH114968A patent/CH487574A/de not_active IP Right Cessation
- 1968-02-10 DE DE1968H0061746 patent/DE1985661U/de not_active Expired
- 1968-02-13 GB GB709668A patent/GB1207265A/en not_active Expired
- 1968-02-14 FR FR1555077D patent/FR1555077A/fr not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1601239A1 (de) * | 2004-05-25 | 2005-11-30 | ebm-papst Mulfingen GmbH & Co.KG | Kühlanordnung für ein elektrisches oder elektronisches Bauteil und Verfahren zu deren Montage |
| FR2914531A1 (fr) * | 2007-03-27 | 2008-10-03 | Valeo Electronique Sys Liaison | Boitier a circuit imprime etanche |
| WO2008142224A3 (fr) * | 2007-03-27 | 2009-03-12 | Valeo Etudes Electroniques | Boitier a circuit imprime etanche |
| WO2013064343A1 (en) * | 2011-11-03 | 2013-05-10 | Osram Gmbh | Driver assembly and method for manufacturing the same |
| US9392716B2 (en) | 2011-11-03 | 2016-07-12 | Osram Gmbh | Driver assembly and method for manufacturing the same |
| CN112993438A (zh) * | 2021-02-08 | 2021-06-18 | 中电科创智联(武汉)有限责任公司 | 一种叉车锂电池半导体热管理系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1985661U (de) | 1968-05-22 |
| FR1555077A (enrdf_load_stackoverflow) | 1969-01-24 |
| CH487574A (de) | 1970-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |