WO2008142224A3 - Boitier a circuit imprime etanche - Google Patents

Boitier a circuit imprime etanche Download PDF

Info

Publication number
WO2008142224A3
WO2008142224A3 PCT/FR2008/000352 FR2008000352W WO2008142224A3 WO 2008142224 A3 WO2008142224 A3 WO 2008142224A3 FR 2008000352 W FR2008000352 W FR 2008000352W WO 2008142224 A3 WO2008142224 A3 WO 2008142224A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit case
lateral wall
sealed printed
wall
Prior art date
Application number
PCT/FR2008/000352
Other languages
English (en)
Other versions
WO2008142224A2 (fr
Inventor
Stephane Tingaud
Anthony Brisset
Original Assignee
Valeo Etudes Electroniques
Stephane Tingaud
Anthony Brisset
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Etudes Electroniques, Stephane Tingaud, Anthony Brisset filed Critical Valeo Etudes Electroniques
Publication of WO2008142224A2 publication Critical patent/WO2008142224A2/fr
Publication of WO2008142224A3 publication Critical patent/WO2008142224A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Or Junction Boxes (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Boîtier pour recevoir au moins un circuit imprimé, ayant une paroi de fond et au moins une paroi latérale (4) principale s'étendant dans une direction, une ouverture (20) étant formée dans la paroi latérale (4) principale, et il est prévu une paroi latérale (8) auxiliaire qui forme avec ladite au moins une paroi latérale principale un espace borgne en forme de poche de réception, l'extension dans la direction de largeur de la paroi auxiliaire étant supérieure ô l'extension dans la direction de largeur de l'ouverture.
PCT/FR2008/000352 2007-03-27 2008-03-18 Boitier a circuit imprime etanche WO2008142224A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0702202 2007-03-27
FR0702202A FR2914531B1 (fr) 2007-03-27 2007-03-27 Boitier a circuit imprime etanche

Publications (2)

Publication Number Publication Date
WO2008142224A2 WO2008142224A2 (fr) 2008-11-27
WO2008142224A3 true WO2008142224A3 (fr) 2009-03-12

Family

ID=39059618

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2008/000352 WO2008142224A2 (fr) 2007-03-27 2008-03-18 Boitier a circuit imprime etanche

Country Status (2)

Country Link
FR (1) FR2914531B1 (fr)
WO (1) WO2008142224A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2979177B1 (fr) * 2011-08-19 2014-05-23 Valeo Sys Controle Moteur Sas Bloc de puissance pour onduleur de vehicule electrique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1207265A (en) * 1967-02-14 1970-09-30 Heberlein & Co Ag Improvements in or relating to circuit components
JPH09200926A (ja) * 1996-01-20 1997-07-31 Denso Corp 電気接続箱
EP1601239A1 (fr) * 2004-05-25 2005-11-30 ebm-papst Mulfingen GmbH & Co.KG Dispositif de refroidissement pour un composant électrique ou électronique ainsi que la maniére de le monter
FR2871022A1 (fr) * 2004-05-25 2005-12-02 Valeo Electronique Sys Liaison Boitier pour circuits electriques ou electroniques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1207265A (en) * 1967-02-14 1970-09-30 Heberlein & Co Ag Improvements in or relating to circuit components
JPH09200926A (ja) * 1996-01-20 1997-07-31 Denso Corp 電気接続箱
EP1601239A1 (fr) * 2004-05-25 2005-11-30 ebm-papst Mulfingen GmbH & Co.KG Dispositif de refroidissement pour un composant électrique ou électronique ainsi que la maniére de le monter
FR2871022A1 (fr) * 2004-05-25 2005-12-02 Valeo Electronique Sys Liaison Boitier pour circuits electriques ou electroniques

Also Published As

Publication number Publication date
FR2914531A1 (fr) 2008-10-03
WO2008142224A2 (fr) 2008-11-27
FR2914531B1 (fr) 2009-06-05

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