GB1207265A - Improvements in or relating to circuit components - Google Patents

Improvements in or relating to circuit components

Info

Publication number
GB1207265A
GB1207265A GB709668A GB709668A GB1207265A GB 1207265 A GB1207265 A GB 1207265A GB 709668 A GB709668 A GB 709668A GB 709668 A GB709668 A GB 709668A GB 1207265 A GB1207265 A GB 1207265A
Authority
GB
United Kingdom
Prior art keywords
box
semi
plastics
trough
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB709668A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heberlein and Co AG
Original Assignee
Heberlein and Co AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH211967A external-priority patent/CH452063A/en
Application filed by Heberlein and Co AG filed Critical Heberlein and Co AG
Publication of GB1207265A publication Critical patent/GB1207265A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1,207,265. Semi-conductor devices. HEBERLEIN & CO. A.G. 13 Feb., 1968 [14 Feb., 1967; 24 Jan., 1968], No. 7096/68. Heading H1K. A flat parallelpiped box has a base 2, side walls 3, 3<SP>1</SP>, and partition walls forming a trough 23 made from a single aluminium casting. The rear wall of the box is of plastics material. A semi-conductor element 24 is located in the trough 23 which is then filled with a plastics filler compound 25 containing quartz sand so that heat generated by the element in operation is swiftly dissipated. A plastics plate 10 bearing a printed circuit is fixed in the box and may carry circuit elements such as resistors, semi -conductors, capacitors &c. Indicator lamps, (12, 13) and a fuse (14), Fig. 2 (not shown) are also provided in the front wall of the box.
GB709668A 1967-02-14 1968-02-13 Improvements in or relating to circuit components Expired GB1207265A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH211967A CH452063A (en) 1967-02-14 1967-02-14 Unit for a circuit device
CH114968A CH487574A (en) 1967-02-14 1968-01-24 Unit for a circuit device

Publications (1)

Publication Number Publication Date
GB1207265A true GB1207265A (en) 1970-09-30

Family

ID=25686808

Family Applications (1)

Application Number Title Priority Date Filing Date
GB709668A Expired GB1207265A (en) 1967-02-14 1968-02-13 Improvements in or relating to circuit components

Country Status (4)

Country Link
CH (1) CH487574A (en)
DE (1) DE1985661U (en)
FR (1) FR1555077A (en)
GB (1) GB1207265A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1601239A1 (en) * 2004-05-25 2005-11-30 ebm-papst Mulfingen GmbH &amp; Co.KG Cooling device for an electric or electronic component and method for mounting the same
FR2914531A1 (en) * 2007-03-27 2008-10-03 Valeo Electronique Sys Liaison Control or power printed circuit board receiving case for automobile field, has auxiliary lateral wall forming shady space with main lateral wall, where extension of direction of space is higher than extension of direction of opening
WO2013064343A1 (en) * 2011-11-03 2013-05-10 Osram Gmbh Driver assembly and method for manufacturing the same
CN112993438A (en) * 2021-02-08 2021-06-18 中电科创智联(武汉)有限责任公司 Semiconductor thermal management system for lithium battery of forklift

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2201612B1 (en) * 1972-10-03 1976-10-29 Cem Comp Electro Mec

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1601239A1 (en) * 2004-05-25 2005-11-30 ebm-papst Mulfingen GmbH &amp; Co.KG Cooling device for an electric or electronic component and method for mounting the same
FR2914531A1 (en) * 2007-03-27 2008-10-03 Valeo Electronique Sys Liaison Control or power printed circuit board receiving case for automobile field, has auxiliary lateral wall forming shady space with main lateral wall, where extension of direction of space is higher than extension of direction of opening
WO2008142224A2 (en) * 2007-03-27 2008-11-27 Valeo Etudes Electroniques Sealed printed circuit case
WO2008142224A3 (en) * 2007-03-27 2009-03-12 Valeo Etudes Electroniques Sealed printed circuit case
WO2013064343A1 (en) * 2011-11-03 2013-05-10 Osram Gmbh Driver assembly and method for manufacturing the same
US9392716B2 (en) 2011-11-03 2016-07-12 Osram Gmbh Driver assembly and method for manufacturing the same
CN112993438A (en) * 2021-02-08 2021-06-18 中电科创智联(武汉)有限责任公司 Semiconductor thermal management system for lithium battery of forklift

Also Published As

Publication number Publication date
CH487574A (en) 1970-03-15
FR1555077A (en) 1969-01-24
DE1985661U (en) 1968-05-22

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees