FR1555077A - - Google Patents

Info

Publication number
FR1555077A
FR1555077A FR1555077DA FR1555077A FR 1555077 A FR1555077 A FR 1555077A FR 1555077D A FR1555077D A FR 1555077DA FR 1555077 A FR1555077 A FR 1555077A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH211967A external-priority patent/CH452063A/de
Application filed filed Critical
Application granted granted Critical
Publication of FR1555077A publication Critical patent/FR1555077A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR1555077D 1967-02-14 1968-02-14 Expired FR1555077A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH211967A CH452063A (de) 1967-02-14 1967-02-14 Baueinheit für eine Schaltungseinrichtung
CH114968A CH487574A (de) 1967-02-14 1968-01-24 Baueinheit für eine Schaltungseinrichtung

Publications (1)

Publication Number Publication Date
FR1555077A true FR1555077A (fr) 1969-01-24

Family

ID=25686808

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1555077D Expired FR1555077A (fr) 1967-02-14 1968-02-14

Country Status (4)

Country Link
CH (1) CH487574A (fr)
DE (1) DE1985661U (fr)
FR (1) FR1555077A (fr)
GB (1) GB1207265A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2201612A1 (fr) * 1972-10-03 1974-04-26 Cem Comp Electro Mec

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004025523A1 (de) * 2004-05-25 2005-12-15 Ebm-Papst Mulfingen Gmbh & Co. Kg Kühlanordnung für ein elektrisches oder elektronisches Bauteil und Verfahren zu deren Montage
FR2914531B1 (fr) * 2007-03-27 2009-06-05 Valeo Electronique Sys Liaison Boitier a circuit imprime etanche
CN103090338B (zh) 2011-11-03 2018-10-09 欧司朗股份有限公司 驱动器组件及其制造方法
CN112993438A (zh) * 2021-02-08 2021-06-18 中电科创智联(武汉)有限责任公司 一种叉车锂电池半导体热管理系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2201612A1 (fr) * 1972-10-03 1974-04-26 Cem Comp Electro Mec

Also Published As

Publication number Publication date
CH487574A (de) 1970-03-15
GB1207265A (en) 1970-09-30
DE1985661U (de) 1968-05-22

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Legal Events

Date Code Title Description
ST Notification of lapse