GB1197580A - Process for Dissolving Metals - Google Patents

Process for Dissolving Metals

Info

Publication number
GB1197580A
GB1197580A GB5221767A GB5221767A GB1197580A GB 1197580 A GB1197580 A GB 1197580A GB 5221767 A GB5221767 A GB 5221767A GB 5221767 A GB5221767 A GB 5221767A GB 1197580 A GB1197580 A GB 1197580A
Authority
GB
United Kingdom
Prior art keywords
acid
etching
copper
aqueous solution
hydrogen peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5221767A
Inventor
Kenneth Dickinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik LCL Ltd
Original Assignee
Laporte Chemicals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laporte Chemicals Ltd filed Critical Laporte Chemicals Ltd
Priority to GB5221767A priority Critical patent/GB1197580A/en
Publication of GB1197580A publication Critical patent/GB1197580A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

1,197,580. Etching. LAPORTE CHEMICALS Ltd. 21 Oct., 1968 [16 Nov., 1967], No. 52217/67. Heading B6J. Copper is etched with an aqueous solution containing 2-10% by weight hydrogen peroxide and from 25 parts per million dipicolinic acid, to which may be added 5-25% sulphuric acid and 50-500 p.p.m. silver nitrate. The Specification also refers to the etching of copper with an acidic aqueous solution containing hydrogen peroxide and a silver salt, in addition to (a) amino carboxylic acid based metal sequestering agents such as ethylene diamine tetra acetic acid, diethylene triamine penta-acetic acid or nitrile triacetic acid, or (b) organic phosphorus based sequestrants, or (c) salts of organic hydroxy acids such as sodium heptonate, or (d) organic acids such as tartaric acid, citric acid.
GB5221767A 1967-11-16 1967-11-16 Process for Dissolving Metals Expired GB1197580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5221767A GB1197580A (en) 1967-11-16 1967-11-16 Process for Dissolving Metals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5221767A GB1197580A (en) 1967-11-16 1967-11-16 Process for Dissolving Metals

Publications (1)

Publication Number Publication Date
GB1197580A true GB1197580A (en) 1970-07-08

Family

ID=10463075

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5221767A Expired GB1197580A (en) 1967-11-16 1967-11-16 Process for Dissolving Metals

Country Status (1)

Country Link
GB (1) GB1197580A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4402788A1 (en) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Process for removing metals
CN108203828A (en) * 2018-01-09 2018-06-26 东莞市耀辉化工科技有限公司 A kind of environmentally friendly hanger stripper of wiring board nitre hanger
CN117684173A (en) * 2023-12-05 2024-03-12 惠州市新纬亚纳米科技有限公司 Copper surface leveling agent, copper surface leveling working solution and copper surface leveling method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4402788A1 (en) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Process for removing metals
CN108203828A (en) * 2018-01-09 2018-06-26 东莞市耀辉化工科技有限公司 A kind of environmentally friendly hanger stripper of wiring board nitre hanger
CN117684173A (en) * 2023-12-05 2024-03-12 惠州市新纬亚纳米科技有限公司 Copper surface leveling agent, copper surface leveling working solution and copper surface leveling method

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees