GB1194853A - A Method of Forming Printed Circuits - Google Patents

A Method of Forming Printed Circuits

Info

Publication number
GB1194853A
GB1194853A GB743767A GB743767A GB1194853A GB 1194853 A GB1194853 A GB 1194853A GB 743767 A GB743767 A GB 743767A GB 743767 A GB743767 A GB 743767A GB 1194853 A GB1194853 A GB 1194853A
Authority
GB
United Kingdom
Prior art keywords
printed
copper
circuits
conductor pattern
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB743767A
Other languages
English (en)
Inventor
John Bryan Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BTR Industries Ltd
Original Assignee
BTR Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BTR Industries Ltd filed Critical BTR Industries Ltd
Priority to GB743767A priority Critical patent/GB1194853A/en
Priority to NL6801988A priority patent/NL6801988A/xx
Priority to DE19681615853 priority patent/DE1615853A1/de
Priority to FR1559157D priority patent/FR1559157A/fr
Publication of GB1194853A publication Critical patent/GB1194853A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB743767A 1967-02-16 1967-02-16 A Method of Forming Printed Circuits Expired GB1194853A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB743767A GB1194853A (en) 1967-02-16 1967-02-16 A Method of Forming Printed Circuits
NL6801988A NL6801988A (enExample) 1967-02-16 1968-02-12
DE19681615853 DE1615853A1 (de) 1967-02-16 1968-02-13 Verfahren zum Herstellen von gedruckten Schaltungen
FR1559157D FR1559157A (enExample) 1967-02-16 1968-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB743767A GB1194853A (en) 1967-02-16 1967-02-16 A Method of Forming Printed Circuits

Publications (1)

Publication Number Publication Date
GB1194853A true GB1194853A (en) 1970-06-17

Family

ID=9833088

Family Applications (1)

Application Number Title Priority Date Filing Date
GB743767A Expired GB1194853A (en) 1967-02-16 1967-02-16 A Method of Forming Printed Circuits

Country Status (4)

Country Link
DE (1) DE1615853A1 (enExample)
FR (1) FR1559157A (enExample)
GB (1) GB1194853A (enExample)
NL (1) NL6801988A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120017A (en) * 1982-05-13 1983-11-23 Kollmorgen Tech Corp Making printed circuit boards having plated through-holes

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556833A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Cirucit board and method of manufacturing same
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
US4690833A (en) * 1986-03-28 1987-09-01 International Business Machines Corporation Providing circuit lines on a substrate
US4994349A (en) * 1988-06-27 1991-02-19 At&T Bell Laboratories Printed wiring board fabrication method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120017A (en) * 1982-05-13 1983-11-23 Kollmorgen Tech Corp Making printed circuit boards having plated through-holes

Also Published As

Publication number Publication date
FR1559157A (enExample) 1969-03-07
DE1615853A1 (de) 1970-05-21
NL6801988A (enExample) 1968-08-19

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Legal Events

Date Code Title Description
PS Patent sealed
PLE Entries relating assignments, transmissions, licences in the register of patents
PCNP Patent ceased through non-payment of renewal fee