GB1189908A - Process for the Contacting of Semi-Conductor Arrangements - Google Patents
Process for the Contacting of Semi-Conductor ArrangementsInfo
- Publication number
- GB1189908A GB1189908A GB48292/67A GB4829267A GB1189908A GB 1189908 A GB1189908 A GB 1189908A GB 48292/67 A GB48292/67 A GB 48292/67A GB 4829267 A GB4829267 A GB 4829267A GB 1189908 A GB1189908 A GB 1189908A
- Authority
- GB
- United Kingdom
- Prior art keywords
- regions
- semi
- type
- electrodes
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000007772 electrode material Substances 0.000 abstract 2
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 239000004922 lacquer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
1,189,908. Semi-conductor devices. WERK FUR FERNSEHELEKTRONIK VEB. 24 Oct., 1967, No. 48292/67. Heading H1K. [Also in Division C7] Electrodes are applied to the P-type regions of a semi-conductor device having at least one PN junction by placing the device in an electrolytic bath and applying an alternating current between an N-type region and a counter electrode in the bath. Electrode material is deposited on the P-type regions owing to the rectifying action of the junction but there is no resultant deposit on the N-type regions. If it is desired to deposit electrodes on N-type regions as well, for example in a transistor, the surface of the device is covered with an oxide layer, windows are formed in the layer at the points where electrodes are required, and metallic conductive tracks are vapour deposited on the layer to connect each N-type region with an adjacent P-type region. Lacquer layers are applied to the tracks except where they contact the regions, and electrolysis is carried out as before so that electrode material is deposited on the exposed parts of the regions.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1614982A DE1614982B2 (en) | 1966-11-09 | 1967-09-15 | Method for galvanic contacting of a multiplicity of semiconductor arrangements arranged in rows on a crystal disk made of semiconductor material |
GB48292/67A GB1189908A (en) | 1966-11-09 | 1967-10-24 | Process for the Contacting of Semi-Conductor Arrangements |
FR125995A FR1541960A (en) | 1966-11-09 | 1967-10-26 | Method of contacting semiconductor devices |
CH1561567A CH489911A (en) | 1966-11-09 | 1967-11-08 | Method for contacting semiconductor arrangements |
SU671196191A SU664244A1 (en) | 1966-11-09 | 1967-11-09 | Method of making contacts for semiconductor devices |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD12080766 | 1966-11-09 | ||
DD12606067 | 1967-07-18 | ||
DEV0034439 | 1967-09-15 | ||
GB48292/67A GB1189908A (en) | 1966-11-09 | 1967-10-24 | Process for the Contacting of Semi-Conductor Arrangements |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1189908A true GB1189908A (en) | 1970-04-29 |
Family
ID=27430180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB48292/67A Expired GB1189908A (en) | 1966-11-09 | 1967-10-24 | Process for the Contacting of Semi-Conductor Arrangements |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH489911A (en) |
DE (1) | DE1614982B2 (en) |
GB (1) | GB1189908A (en) |
SU (1) | SU664244A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19963550B4 (en) * | 1999-12-22 | 2004-05-06 | Epigap Optoelektronik Gmbh | Bipolar illumination source from a self-bundling semiconductor body contacted on one side |
DE102011005743B3 (en) * | 2011-03-17 | 2012-07-26 | Semikron Elektronik Gmbh & Co. Kg | Method for depositing a metal layer on a semiconductor device |
DE102013217300A1 (en) * | 2013-08-30 | 2014-05-08 | Robert Bosch Gmbh | MEMS microphone device, has electrically separate electrode portions formed in doped semiconductor layer and electrically separated from each other by p/n junction, and capacitor arrangement provided with electrode |
-
1967
- 1967-09-15 DE DE1614982A patent/DE1614982B2/en not_active Ceased
- 1967-10-24 GB GB48292/67A patent/GB1189908A/en not_active Expired
- 1967-11-08 CH CH1561567A patent/CH489911A/en not_active IP Right Cessation
- 1967-11-09 SU SU671196191A patent/SU664244A1/en active
Also Published As
Publication number | Publication date |
---|---|
DE1614982B2 (en) | 1974-02-21 |
DE1614982A1 (en) | 1971-02-25 |
SU664244A1 (en) | 1979-05-25 |
CH489911A (en) | 1970-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |