GB1154152A - Organic Seeding Composition - Google Patents
Organic Seeding CompositionInfo
- Publication number
- GB1154152A GB1154152A GB2442766A GB2442766A GB1154152A GB 1154152 A GB1154152 A GB 1154152A GB 2442766 A GB2442766 A GB 2442766A GB 2442766 A GB2442766 A GB 2442766A GB 1154152 A GB1154152 A GB 1154152A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- june
- acids
- dissolved
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
1,154,152. Coating with metals. PHOTOCIRCUITS CORP. June 1, 1966 [June 1, 1965], No.24427/66. Heading C7F. An insulating substrate is sensitized for electroless plating of e.g. Cu by applying a compound of tin or an element selected from Groups 8 and 1B of the Periodic Table dissolved in an organic solvent. Salts or oxides of Fe, Co, Au, Ag, Pt, Pd, Rh, Cu and Ir dissolved in aldehydes, ketones, acids, alcohols, sulphoxides, heterocyclic nitrogen compounds, ethers, esters, halogenated hydrocarbons, carboxylic acids and amines may be used. The solvent may be in the form of or may include a thermoplastic or thermosetting resin. The substrate may be plastics, e.g. polyesters, epoxy or phenolic resins, paper wood or glass or polyester fibres A surfactant e:g: glycerides of unsaturated fatty acids may be included: The sensitizing material may be in the form of an ink, applied to a substrate and polymerized in situ:
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46058565A | 1965-06-01 | 1965-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1154152A true GB1154152A (en) | 1969-06-04 |
Family
ID=23829306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2442766A Expired GB1154152A (en) | 1965-06-01 | 1966-06-01 | Organic Seeding Composition |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT280725B (en) |
BE (1) | BE681865A (en) |
DE (1) | DE1521445C3 (en) |
DK (1) | DK132801C (en) |
ES (1) | ES327380A1 (en) |
GB (1) | GB1154152A (en) |
NL (1) | NL151444B (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0153683A2 (en) * | 1984-02-28 | 1985-09-04 | Bayer Ag | Process for making circuit boards |
US4661384A (en) * | 1984-06-29 | 1987-04-28 | Bayer Aktiengesellschaft | Process for activating substrate surfaces for electroless metallization |
EP0271466A2 (en) * | 1986-11-07 | 1988-06-15 | Monsanto Company | Selective catalytic activation of polymeric films |
US4764401A (en) * | 1981-12-05 | 1988-08-16 | Bayer Aktiengesellschaft | Process for activating substrate surfaces for electroless metallization |
US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
WO1992013981A2 (en) * | 1991-02-08 | 1992-08-20 | Atotech Deutschland Gmbh | Selective process for printed circuit board manufacturing |
US7989029B1 (en) | 2007-06-21 | 2011-08-02 | Sri International | Reduced porosity copper deposition |
US8110254B1 (en) | 2006-09-12 | 2012-02-07 | Sri International | Flexible circuit chemistry |
US8124226B2 (en) | 2006-09-12 | 2012-02-28 | Sri International | Flexible circuits |
US8628818B1 (en) | 2007-06-21 | 2014-01-14 | Sri International | Conductive pattern formation |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
CZ309595B6 (en) * | 2022-03-18 | 2023-05-03 | Ego 93 S.R.O. | Activating solution and preparing it |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK153572C (en) * | 1982-02-18 | 1988-12-19 | Platonec Aps | POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF |
-
1966
- 1966-05-26 DE DE1966P0039535 patent/DE1521445C3/en not_active Expired
- 1966-05-31 BE BE681865D patent/BE681865A/xx unknown
- 1966-05-31 DK DK279966A patent/DK132801C/en active
- 1966-05-31 ES ES0327380A patent/ES327380A1/en not_active Expired
- 1966-06-01 NL NL6607558A patent/NL151444B/en not_active IP Right Cessation
- 1966-06-01 AT AT519666A patent/AT280725B/en not_active IP Right Cessation
- 1966-06-01 GB GB2442766A patent/GB1154152A/en not_active Expired
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4764401A (en) * | 1981-12-05 | 1988-08-16 | Bayer Aktiengesellschaft | Process for activating substrate surfaces for electroless metallization |
US4830714A (en) * | 1984-02-28 | 1989-05-16 | Bayer Aktiengesellschaft | Process for the production of printed circuit boards |
EP0153683A3 (en) * | 1984-02-28 | 1987-07-01 | Bayer Ag | Process for making circuit boards |
EP0153683A2 (en) * | 1984-02-28 | 1985-09-04 | Bayer Ag | Process for making circuit boards |
US4661384A (en) * | 1984-06-29 | 1987-04-28 | Bayer Aktiengesellschaft | Process for activating substrate surfaces for electroless metallization |
US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
EP0271466A3 (en) * | 1986-11-07 | 1988-10-12 | Monsanto Company | Selective catalytic activation of polymeric films |
US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
AU598055B2 (en) * | 1986-11-07 | 1990-06-14 | Amesbury Group, Inc. | Selective catalytic activation of polymeric films |
EP0271466A2 (en) * | 1986-11-07 | 1988-06-15 | Monsanto Company | Selective catalytic activation of polymeric films |
WO1992013981A3 (en) * | 1991-02-08 | 1992-11-26 | Schering Ag | Selective process for printed circuit board manufacturing |
WO1992013981A2 (en) * | 1991-02-08 | 1992-08-20 | Atotech Deutschland Gmbh | Selective process for printed circuit board manufacturing |
US8110254B1 (en) | 2006-09-12 | 2012-02-07 | Sri International | Flexible circuit chemistry |
US8124226B2 (en) | 2006-09-12 | 2012-02-28 | Sri International | Flexible circuits |
US8911608B1 (en) * | 2006-09-12 | 2014-12-16 | Sri International | Flexible circuit formation |
US7989029B1 (en) | 2007-06-21 | 2011-08-02 | Sri International | Reduced porosity copper deposition |
US8628818B1 (en) | 2007-06-21 | 2014-01-14 | Sri International | Conductive pattern formation |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
CZ309595B6 (en) * | 2022-03-18 | 2023-05-03 | Ego 93 S.R.O. | Activating solution and preparing it |
Also Published As
Publication number | Publication date |
---|---|
DE1521445B2 (en) | 1976-12-30 |
NL6607558A (en) | 1966-12-02 |
AT280725B (en) | 1970-04-27 |
DK132801C (en) | 1976-07-12 |
DE1521445C3 (en) | 1979-11-29 |
DE1521445A1 (en) | 1970-10-08 |
BE681865A (en) | 1966-10-31 |
NL151444B (en) | 1976-11-15 |
ES327380A1 (en) | 1967-07-16 |
DK132801B (en) | 1976-02-09 |
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