DK132801C - PROCEDURE FOR MAKING INSULATING SUBSTRATES CATALYTIC TRANSFER RECEIVING ELECTRICALLY DEPOSITED METAL AND SEEDING MATERIAL FOR USE OF THE PROCEDURE - Google Patents
PROCEDURE FOR MAKING INSULATING SUBSTRATES CATALYTIC TRANSFER RECEIVING ELECTRICALLY DEPOSITED METAL AND SEEDING MATERIAL FOR USE OF THE PROCEDUREInfo
- Publication number
- DK132801C DK132801C DK279966A DK279966A DK132801C DK 132801 C DK132801 C DK 132801C DK 279966 A DK279966 A DK 279966A DK 279966 A DK279966 A DK 279966A DK 132801 C DK132801 C DK 132801C
- Authority
- DK
- Denmark
- Prior art keywords
- procedure
- deposited metal
- insulating substrates
- transfer receiving
- seeding material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46058565A | 1965-06-01 | 1965-06-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK132801B DK132801B (en) | 1976-02-09 |
DK132801C true DK132801C (en) | 1976-07-12 |
Family
ID=23829306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK279966A DK132801C (en) | 1965-06-01 | 1966-05-31 | PROCEDURE FOR MAKING INSULATING SUBSTRATES CATALYTIC TRANSFER RECEIVING ELECTRICALLY DEPOSITED METAL AND SEEDING MATERIAL FOR USE OF THE PROCEDURE |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT280725B (en) |
BE (1) | BE681865A (en) |
DE (1) | DE1521445C3 (en) |
DK (1) | DK132801C (en) |
ES (1) | ES327380A1 (en) |
GB (1) | GB1154152A (en) |
NL (1) | NL151444B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3148280A1 (en) * | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION |
DK153572C (en) * | 1982-02-18 | 1988-12-19 | Platonec Aps | POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF |
DE3407114A1 (en) * | 1984-02-28 | 1985-09-05 | Bayer Ag, 5090 Leverkusen | METHOD FOR THE PRODUCTION OF CIRCUIT BOARDS |
DE3424065A1 (en) * | 1984-06-29 | 1986-01-09 | Bayer Ag, 5090 Leverkusen | METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION |
US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
US5250105A (en) * | 1991-02-08 | 1993-10-05 | Eid-Empresa De Investigacao E Desenvolvimento De Electronica S.A. | Selective process for printing circuit board manufacturing |
US7981508B1 (en) | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
US8110254B1 (en) | 2006-09-12 | 2012-02-07 | Sri International | Flexible circuit chemistry |
US8628818B1 (en) | 2007-06-21 | 2014-01-14 | Sri International | Conductive pattern formation |
US7989029B1 (en) | 2007-06-21 | 2011-08-02 | Sri International | Reduced porosity copper deposition |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
CZ309595B6 (en) * | 2022-03-18 | 2023-05-03 | Ego 93 S.R.O. | Activating solution and preparing it |
-
1966
- 1966-05-26 DE DE1966P0039535 patent/DE1521445C3/en not_active Expired
- 1966-05-31 ES ES0327380A patent/ES327380A1/en not_active Expired
- 1966-05-31 BE BE681865D patent/BE681865A/xx unknown
- 1966-05-31 DK DK279966A patent/DK132801C/en active
- 1966-06-01 NL NL6607558A patent/NL151444B/en not_active IP Right Cessation
- 1966-06-01 AT AT519666A patent/AT280725B/en not_active IP Right Cessation
- 1966-06-01 GB GB2442766A patent/GB1154152A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
BE681865A (en) | 1966-10-31 |
ES327380A1 (en) | 1967-07-16 |
GB1154152A (en) | 1969-06-04 |
NL151444B (en) | 1976-11-15 |
DE1521445A1 (en) | 1970-10-08 |
DK132801B (en) | 1976-02-09 |
DE1521445B2 (en) | 1976-12-30 |
AT280725B (en) | 1970-04-27 |
DE1521445C3 (en) | 1979-11-29 |
NL6607558A (en) | 1966-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK132801C (en) | PROCEDURE FOR MAKING INSULATING SUBSTRATES CATALYTIC TRANSFER RECEIVING ELECTRICALLY DEPOSITED METAL AND SEEDING MATERIAL FOR USE OF THE PROCEDURE | |
DK145615C (en) | PROCEDURE FOR THE PREPARATION OF A METAL DEPOSIT SUITABLE, INSULATING BASIC MATERIAL, PRESENTLY USED FOR THE PREPARATION OF PRINTED CIRCUITS | |
GB1557485A (en) | Process for the preparation of metallic and or metal ceramic and or ceramic sponges | |
IL48264A0 (en) | Platinum-rhodium-containing high temperature alloy coatin | |
DK37176A (en) | CONTAINER AND SHAPE FOR ITS MANUFACTURE | |
JPS5276751A (en) | Microwave furnace | |
GB1557711A (en) | Microwave circuit element | |
JPS53110133A (en) | Porcelain heating element made from positive characteristic semiconductor | |
NO772880L (en) | DEVICES FOR HEATING USING ULTRA-HIGH FREQUENCIES | |
AT363380B (en) | CERAMIC DIELECTRIC MATERIAL | |
NO139915C (en) | CONTAINER PLATE OF METAL, AS WELL AS PROCEDURE AND APPLIANCE FOR ITS MANUFACTURE | |
JPS5289846A (en) | Microwave heater | |
DK168076A (en) | ELECTRICALLY LEADING CONGROG AND PROCEDURE FOR ITS MANUFACTURE AND USE | |
NL7612121A (en) | CERAMIC DIELECTRIC MATERIAL. | |
NO143146C (en) | PROCEDURE FOR THE MANUFACTURE OF NICKEL (III) HYDROXIC SIDE | |
DK131642C (en) | PROCEDURE FOR ANAPHORETIC COATING OF AN ELECTRICALLY CONDUCTIVE OBJECT AND COATING MATERIAL FOR USE OF THE PROCEDURE | |
YU40018B (en) | Process for the manufature of dielectric ceramic of predetermined dielectrical temperature coefficient | |
NO152375C (en) | Electrode for Electrodevelopment of Nickel, and Procedure for Manufacturing the Electrode | |
DK131643C (en) | PROCEDURE FOR ANAPHORETIC COATING OF AN ELECTRICALLY CONDUCTIVE OBJECT AND COATING MATERIAL FOR USE OF THE PROCEDURE | |
IL32374A0 (en) | High temperature metallic diffusion coating method | |
SE7704889L (en) | PROCEDURE FOR CASTING MELTORS OF METALLIC MATERIAL | |
JPS5229373A (en) | Receptacle made of metallic net | |
PL208011A1 (en) | CIRCULATOR / HIGH FREQUENCY INSULATOR | |
FR2332964A1 (en) | FERRO-ELECTRIC CERAMIC MATERIAL | |
IL25769A (en) | Process for the manufacture of hydroxocobalamine from cyanocobalamine |