AT280725B - Process for the production of activated or germinated materials intended for metallization without an external power supply and a germination solution for carrying out the process - Google Patents

Process for the production of activated or germinated materials intended for metallization without an external power supply and a germination solution for carrying out the process

Info

Publication number
AT280725B
AT280725B AT519666A AT519666A AT280725B AT 280725 B AT280725 B AT 280725B AT 519666 A AT519666 A AT 519666A AT 519666 A AT519666 A AT 519666A AT 280725 B AT280725 B AT 280725B
Authority
AT
Austria
Prior art keywords
germinated
metallization
activated
carrying
production
Prior art date
Application number
AT519666A
Other languages
German (de)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT280725B publication Critical patent/AT280725B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
AT519666A 1965-06-01 1966-06-01 Process for the production of activated or germinated materials intended for metallization without an external power supply and a germination solution for carrying out the process AT280725B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46058565A 1965-06-01 1965-06-01

Publications (1)

Publication Number Publication Date
AT280725B true AT280725B (en) 1970-04-27

Family

ID=23829306

Family Applications (1)

Application Number Title Priority Date Filing Date
AT519666A AT280725B (en) 1965-06-01 1966-06-01 Process for the production of activated or germinated materials intended for metallization without an external power supply and a germination solution for carrying out the process

Country Status (7)

Country Link
AT (1) AT280725B (en)
BE (1) BE681865A (en)
DE (1) DE1521445C3 (en)
DK (1) DK132801C (en)
ES (1) ES327380A1 (en)
GB (1) GB1154152A (en)
NL (1) NL151444B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3148280A1 (en) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
DK153572C (en) * 1982-02-18 1988-12-19 Platonec Aps POWDER USED BY TWO ACTIVATION FOR POWERFUL METALLIZATION, PROCEDURE FOR PREPARING THEREOF AND USE THEREOF
DE3407114A1 (en) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen METHOD FOR THE PRODUCTION OF CIRCUIT BOARDS
DE3424065A1 (en) * 1984-06-29 1986-01-09 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US5250105A (en) * 1991-02-08 1993-10-05 Eid-Empresa De Investigacao E Desenvolvimento De Electronica S.A. Selective process for printing circuit board manufacturing
US8110254B1 (en) 2006-09-12 2012-02-07 Sri International Flexible circuit chemistry
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8628818B1 (en) 2007-06-21 2014-01-14 Sri International Conductive pattern formation
US7989029B1 (en) 2007-06-21 2011-08-02 Sri International Reduced porosity copper deposition
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
CZ2022126A3 (en) * 2022-03-18 2023-05-03 Ego 93 S.R.O. Activating solution and preparing it

Also Published As

Publication number Publication date
DE1521445B2 (en) 1976-12-30
GB1154152A (en) 1969-06-04
NL6607558A (en) 1966-12-02
BE681865A (en) 1966-10-31
DE1521445A1 (en) 1970-10-08
ES327380A1 (en) 1967-07-16
DK132801B (en) 1976-02-09
NL151444B (en) 1976-11-15
DE1521445C3 (en) 1979-11-29
DK132801C (en) 1976-07-12

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee