GB1149606A - Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses - Google Patents
Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stressesInfo
- Publication number
- GB1149606A GB1149606A GB4779/68A GB477968A GB1149606A GB 1149606 A GB1149606 A GB 1149606A GB 4779/68 A GB4779/68 A GB 4779/68A GB 477968 A GB477968 A GB 477968A GB 1149606 A GB1149606 A GB 1149606A
- Authority
- GB
- United Kingdom
- Prior art keywords
- aluminium
- nickel
- layer
- wafer
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01072—Hafnium [Hf]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61863867A | 1967-02-27 | 1967-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1149606A true GB1149606A (en) | 1969-04-23 |
Family
ID=24478504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4779/68A Expired GB1149606A (en) | 1967-02-27 | 1968-01-30 | Mounting for a semiconductor wafer which is resistant to fatigue caused by thermal stresses |
Country Status (4)
Country | Link |
---|---|
BE (1) | BE711076A (US06265458-20010724-C00056.png) |
FR (1) | FR1555176A (US06265458-20010724-C00056.png) |
GB (1) | GB1149606A (US06265458-20010724-C00056.png) |
NL (1) | NL6802104A (US06265458-20010724-C00056.png) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0070435A2 (en) * | 1981-07-02 | 1983-01-26 | Matsushita Electronics Corporation | Semiconductor device comprising a semiconductor substrate bonded to a mounting means |
EP0071314A2 (en) * | 1981-07-31 | 1983-02-09 | Koninklijke Philips Electronics N.V. | Semiconductor devices and a solder for use in such devices |
DE3443784A1 (de) * | 1983-11-30 | 1985-07-18 | Mitsubishi Denki K.K., Tokio/Tokyo | Gate-abschaltthyristor |
DE19606101A1 (de) * | 1996-02-19 | 1997-08-21 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht |
EP1195805A2 (en) * | 2000-10-05 | 2002-04-10 | SANYO ELECTRIC Co., Ltd. | Heat radiation substrate and semiconductor module |
US20070173045A1 (en) | 2006-01-23 | 2007-07-26 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH662007A5 (en) * | 1983-12-21 | 1987-08-31 | Bbc Brown Boveri & Cie | Method of soldering semiconductor components |
-
1968
- 1968-01-30 GB GB4779/68A patent/GB1149606A/en not_active Expired
- 1968-02-14 NL NL6802104A patent/NL6802104A/xx unknown
- 1968-02-21 BE BE711076D patent/BE711076A/xx unknown
- 1968-02-26 FR FR1555176D patent/FR1555176A/fr not_active Expired
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0070435A2 (en) * | 1981-07-02 | 1983-01-26 | Matsushita Electronics Corporation | Semiconductor device comprising a semiconductor substrate bonded to a mounting means |
EP0070435A3 (en) * | 1981-07-02 | 1984-11-21 | Matsushita Electronics Corporation | Semiconductor device comprising a semiconductor substrate bonded to a mounting means |
EP0071314A2 (en) * | 1981-07-31 | 1983-02-09 | Koninklijke Philips Electronics N.V. | Semiconductor devices and a solder for use in such devices |
EP0071314A3 (en) * | 1981-07-31 | 1984-04-25 | Philips Electronic And Associated Industries Limited | Semiconductor devices and a solder for use in such devices |
DE3443784A1 (de) * | 1983-11-30 | 1985-07-18 | Mitsubishi Denki K.K., Tokio/Tokyo | Gate-abschaltthyristor |
DE3448379C2 (de) * | 1983-11-30 | 1993-12-16 | Mitsubishi Electric Corp | Gate-Abschaltthyristor |
DE19606101A1 (de) * | 1996-02-19 | 1997-08-21 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht |
US5901901A (en) * | 1996-02-19 | 1999-05-11 | Siemens Aktiengesellschaft | Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly |
EP1195805A2 (en) * | 2000-10-05 | 2002-04-10 | SANYO ELECTRIC Co., Ltd. | Heat radiation substrate and semiconductor module |
EP1195805A3 (en) * | 2000-10-05 | 2006-06-14 | SANYO ELECTRIC Co., Ltd. | Heat radiation substrate and semiconductor module |
US20070173045A1 (en) | 2006-01-23 | 2007-07-26 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor device |
DE102006062029B4 (de) * | 2006-01-23 | 2010-04-08 | Mitsubishi Electric Corp. | Verfahren zum Herstellen einer Halbleitervorrichtung |
US8183144B2 (en) | 2006-01-23 | 2012-05-22 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
BE711076A (US06265458-20010724-C00056.png) | 1968-08-21 |
FR1555176A (US06265458-20010724-C00056.png) | 1969-01-24 |
NL6802104A (US06265458-20010724-C00056.png) | 1968-08-28 |
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