GB1120625A - Improvements in or relating to laminates - Google Patents

Improvements in or relating to laminates

Info

Publication number
GB1120625A
GB1120625A GB3830764D GB3830764D GB1120625A GB 1120625 A GB1120625 A GB 1120625A GB 3830764 D GB3830764 D GB 3830764D GB 3830764 D GB3830764 D GB 3830764D GB 1120625 A GB1120625 A GB 1120625A
Authority
GB
United Kingdom
Prior art keywords
substrate
steel
indentation pattern
lamina
gauze
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3830764D
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RAYMOND HERBERT GEORGE SALKILL
ROBERT ASHLEY YARNOLD
General Electric Co PLC
Original Assignee
RAYMOND HERBERT GEORGE SALKILL
ROBERT ASHLEY YARNOLD
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RAYMOND HERBERT GEORGE SALKILL, ROBERT ASHLEY YARNOLD, General Electric Co PLC filed Critical RAYMOND HERBERT GEORGE SALKILL
Priority to GB3830764D priority Critical patent/GB1120625A/en
Publication of GB1120625A publication Critical patent/GB1120625A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

1,120,625. Laminates. GENERAL ELECTRIC CO. Ltd., R. A. YARNOLD and R. H. G. SALKILLD. 8 Sept., 1965 [18 Sept., 1964], No. 38307/64. Heading B5N. A method of forming a laminate comprises impressing a substantially regular indentation pattern into a surface of a lamina so that in bounding the lamina to another lamina under pressure there are regions of locally increased pressure corresponding to the indentation pattern. In the example given a printed circuit board comprising a conductor layer of nickel foil, and a substrate of polyethylene terephthalate, is formed by arranging the foil and substrate to sandwich a layer of thermosetting resin, placing a piece of steel gauze in contact with the outer surface of the substrate, placing the assembly between two steel platens, and compressing the whole in a heating press until the resin has at least partially set. On removal from the press the steel gauze, which has impressed the indentation pattern in the substrate, is removed from the laminate. Instead of using a separate gauze the indentation pattern can be formed in the steel platen which backs the substrate.
GB3830764D 1964-09-18 1964-09-18 Improvements in or relating to laminates Expired GB1120625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3830764D GB1120625A (en) 1964-09-18 1964-09-18 Improvements in or relating to laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3830764D GB1120625A (en) 1964-09-18 1964-09-18 Improvements in or relating to laminates

Publications (1)

Publication Number Publication Date
GB1120625A true GB1120625A (en) 1968-07-24

Family

ID=10402599

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3830764D Expired GB1120625A (en) 1964-09-18 1964-09-18 Improvements in or relating to laminates

Country Status (1)

Country Link
GB (1) GB1120625A (en)

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