GB1115937A - Method and apparatus for sputtering thin film resistance elements - Google Patents
Method and apparatus for sputtering thin film resistance elementsInfo
- Publication number
- GB1115937A GB1115937A GB5082365A GB5082365A GB1115937A GB 1115937 A GB1115937 A GB 1115937A GB 5082365 A GB5082365 A GB 5082365A GB 5082365 A GB5082365 A GB 5082365A GB 1115937 A GB1115937 A GB 1115937A
- Authority
- GB
- United Kingdom
- Prior art keywords
- target
- substrate
- thin film
- sputtering
- resistance elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
Abstract
<PICT:1115937/C6-C7/1> Thin film thermistor resistors are made by sputtering resistor material such as metal oxides, metal sulphides or metal borates on to a substrate such as silicon in a stream of ionised gas such as argon, oxygen or hydrogen which is constrained e.g. magnetically between the substrate and the cathode. The apparatus comprises a vacuum chamber 13 surrounded by magnetic coil 12 and containing a filament assembly 16 for ionising a gas introduced via 18, a target 20, substrate 22 and anode 24 located above and between the target and substrate. The target may be a sintered ceramic consisting of 80.1% MnO, 17.6% Ni0 and 2.3% CoO and may be platinized on one side for electrical contact. A carbon mask may be placed between the target and the substrate. On completion of one sputtering a second target may be rotated into position and electrodes sputtered on to the resistor.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43511965A | 1965-02-25 | 1965-02-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1115937A true GB1115937A (en) | 1968-06-06 |
Family
ID=23727060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5082365A Expired GB1115937A (en) | 1965-02-25 | 1965-11-30 | Method and apparatus for sputtering thin film resistance elements |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1590879A1 (en) |
GB (1) | GB1115937A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62291002A (en) * | 1986-06-10 | 1987-12-17 | 日本鋼管株式会社 | Manufacture of thin film thermistor |
EP1058276A2 (en) * | 1999-06-03 | 2000-12-06 | Matsushita Electric Industrial Co., Ltd. | Thin film thermistor element and method for the fabrication of thin film thermistor element |
-
1965
- 1965-11-30 GB GB5082365A patent/GB1115937A/en not_active Expired
-
1966
- 1966-02-24 DE DE19661590879 patent/DE1590879A1/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62291002A (en) * | 1986-06-10 | 1987-12-17 | 日本鋼管株式会社 | Manufacture of thin film thermistor |
JPH0354842B2 (en) * | 1986-06-10 | 1991-08-21 | ||
EP1058276A2 (en) * | 1999-06-03 | 2000-12-06 | Matsushita Electric Industrial Co., Ltd. | Thin film thermistor element and method for the fabrication of thin film thermistor element |
EP1058276A3 (en) * | 1999-06-03 | 2004-01-28 | Matsushita Electric Industrial Co., Ltd. | Thin film thermistor element and method for the fabrication of thin film thermistor element |
Also Published As
Publication number | Publication date |
---|---|
DE1590879A1 (en) | 1970-05-06 |
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